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公开(公告)号：US20230092004A1
公开(公告)日：2023-03-23
申请号：US17879411
申请日：2022-08-02
Applicant: Apple Inc.
Inventor： Peter C. Hrudey , Gokhan Hatipoglu , Anthony D. Minervini
IPC: G10K11/172 , B81B3/00 , H04R1/28
Abstract: An acoustic device comprising: an enclosure defining an acoustic port and an acoustic pathway between the acoustic port and a transducer coupled to the enclosure; and an array of attenuators acoustically coupled to the acoustic pathway to absorb ultrasonic acoustic waves.
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公开(公告)号：US20180215609A1
公开(公告)日：2018-08-02
申请号：US15419663
申请日：2017-01-30
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Anthony D. Minervini , Ruchir M. Dave , Jae H. Lee
CPC classification number: B81B7/0038 , B81B2201/0257 , B81B2207/012 , B81C1/00285 , B81C2201/0109 , B81C2201/013 , H04R19/005 , H04R19/04 , H04R31/00
Abstract: A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.
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公开(公告)号：US11902727B2
公开(公告)日：2024-02-13
申请号：US17670387
申请日：2022-02-11
Applicant: Apple Inc.
Inventor： Anthony D. Minervini , Peter C. Hrudey , Gokhan Hatipoglu
CPC classification number: H04R1/023 , B81B7/02 , H04R1/08 , H04R1/2803 , H04R1/2873 , B81B2201/0257 , H04R2499/11
Abstract: Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.
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公开(公告)号：US20240107249A1
公开(公告)日：2024-03-28
申请号：US18119600
申请日：2023-03-09
Applicant: Apple Inc.
Inventor： Kyusang KIM , Ali N. Ergun , Anthony D. Minervini , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan
Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.
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公开(公告)号：US11882394B2
公开(公告)日：2024-01-23
申请号：US17670347
申请日：2022-02-11
Applicant: Apple Inc.
Inventor： Anthony D. Minervini , Peter C. Hrudey , Gokhan Hatipoglu
Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.
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Patent Agency Ranking
6.发明授权公开(公告)号：US11635334B2
公开(公告)日：2023-04-25
申请号：US16917704
申请日：2020-06-30
Applicant: Apple Inc.
Inventor： Helia Rahmani , Anthony D. Minervini , Wanfeng Huang , James C. Clements , Jiandong Yu , Zijing Zeng , Charley T. Ogata
Abstract: Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.
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公开(公告)号：US11228846B2
公开(公告)日：2022-01-18
申请号：US16792043
申请日：2020-02-14
Applicant: Apple Inc.
Inventor： Florence W. Ow , Peter C. Hrudey , Yu-Chun Hsu , Anthony D. Minervini , John K. Queeney , Tavys Q. Ashcroft
Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.
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公开(公告)号：US20180220216A1
公开(公告)日：2018-08-02
申请号：US15726306
申请日：2017-10-05
Applicant: Apple Inc.
Inventor： Janhavi S. Agashe , Anthony D. Minervini , Ruchir M. Dave , Jae H. Lee
CPC classification number: H04R1/08 , B81B3/0083 , B81B3/0089 , B81B2201/0257 , G02B5/208 , G02B5/26 , H04R19/005 , H04R19/04
Abstract: A micro-electro-mechanical system (MEMS) transducer including an enclosure defining an interior space and having an acoustic port formed through at least one side of the enclosure. The transducer further including a compliant member positioned within the interior space and acoustically coupled to the acoustic port, the compliant member being configured to vibrate in response to an acoustic input. A back plate is further positioned within the interior space, the back plate being positioned along one side of the compliant member in a fixed position. A filter is positioned between the compliant member and the acoustic port, and the filter includes a plurality of axially oriented pathways and a plurality of laterally oriented pathways which are acoustically interconnected and dimensioned to prevent passage of a particle from the acoustic port to the compliant member.
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公开(公告)号：US12223938B2
公开(公告)日：2025-02-11
申请号：US17879411
申请日：2022-08-02
Applicant: Apple Inc.
Inventor： Peter C. Hrudey , Gokhan Hatipoglu , Anthony D. Minervini
IPC: G10K11/172 , B81B3/00 , H04R1/28
Abstract: An acoustic device comprising: an enclosure defining an acoustic port and an acoustic pathway between the acoustic port and a transducer coupled to the enclosure; and an array of attenuators acoustically coupled to the acoustic pathway to absorb ultrasonic acoustic waves.
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公开(公告)号：US10587942B1
公开(公告)日：2020-03-10
申请号：US16146983
申请日：2018-09-28
Applicant: Apple Inc
Inventor： Anthony D. Minervini , David S. Wilkes, Jr. , Nikolas T. Vitt , Peter C. Hrudey , Ruchir M. Dave , Amin M. Younes
Abstract: A liquid-resistant microphone assembly includes a substrate defining a sound-entry region and a microphone transducer coupled with the substrate. The transducer has a sound-responsive region acoustically coupled with the sound-entry opening defined by the substrate. A liquid-resistant port membrane spans across the sound-entry opening defined by the substrate. The membrane is gas-permeable. An adhesive layer is positioned between the substrate and the liquid-resistant port membrane, coupling the liquid-resistant port membrane with the substrate and spacing the liquid-resistant port membrane from the substrate to form a gap between the membrane and the substrate. The adhesive layer defines an aperture having a periphery extending around and positioned outward of the sound-entry region. Modules and electronic devices incorporating such a microphone transducer also are disclosed.
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