公开(公告)号：US11812831B1

公开(公告)日：2023-11-14

申请号：US17368664

申请日：2021-07-06

Applicant: Apple Inc.

Inventor： William Leith ,  Travis C. Pedley ,  Mark W. Townsend ,  Camille I. Henrot ,  Austin S. Glover

IPC: A45C11/00 ,  B32B5/02 ,  B32B5/26 ,  B32B7/09

CPC classification number: A45C11/00 ,  B32B5/024 ,  B32B5/026 ,  B32B5/2795 ,  B32B7/09 ,  A45C2011/001 ,  A45C2011/002 ,  A45C2011/003

Abstract: A cover for an electronic device may be formed from fabric. The cover may include a front cover portion and a rear cover portion that rotate relative to one another about a first bend axis. The front cover portion may have first and second panels that rotate relative to one another about a second bend axis. The cover may have flexible hinge regions along the first and second bend axes. The flexible hinge regions may include spacer fabric having first and second warp knit fabric layers and spacer strands coupled between the first and second warp knit fabric layers. Stiffeners may be used to stiffen portions of the cover between the flexible hinge regions. An inlay strand may be located in the flexible hinge region in the front cover portion to restrict the range of motion of the first panel relative to the second panel.