Electronic devices with displays and interposer structures

    公开(公告)号:US12112681B2

    公开(公告)日:2024-10-08

    申请号:US17825367

    申请日:2022-05-26

    Applicant: Apple Inc.

    CPC classification number: G09G3/2092 G09G2300/0408 G09G2300/0426

    Abstract: An electronic device may have a display. The display may include an array of pixels formed on a silicon substrate. Display driver circuitry may be formed in a display driver integrated circuit that outputs display data and other control signals for operating the display. An interposer structure may be included in the electronic device. The interposer structure may be attached to the silicon display substrate and may only partially overlap the silicon display substrate. The display driver integrated circuit may be attached to the interposer structure and provide signals to the display pixels through the interposer structure. In another possible arrangement, the display driver integrated circuit may bridge a gap between the silicon display substrate and the flexible printed circuit. The display driver integrated circuit only partially overlaps the silicon display substrate in this arrangement.

    Hybrid Displays
    2.
    发明公开
    Hybrid Displays 审中-公开

    公开(公告)号:US20240310635A1

    公开(公告)日:2024-09-19

    申请号:US18671793

    申请日:2024-05-22

    Applicant: Apple Inc.

    Abstract: A hybrid display may include different display portions with different resolutions. The high resolution display portion may be positioned in a main viewing area for the viewer whereas the low resolution display portion may be positioned in a peripheral viewing area. The high resolution display portion may have a silicon backplane. The low resolution display portion may have a different type of backplane such as a thin-film transistor backplane. The different display portions may optionally share a common organic light-emitting diode layer such that light is emitted from the same plane across both display portions. The high resolution display portion may emit light through a transparent window in the low resolution display portion. A high resolution display may also be formed by separately forming a frontplane and a backplane. Conductive attachment structures such as indium bumps may be used to mechanically and electrically connect the backplane to the frontplane.

    Electronic Devices with Displays and Interposer Structures

    公开(公告)号:US20230062202A1

    公开(公告)日:2023-03-02

    申请号:US17825367

    申请日:2022-05-26

    Applicant: Apple Inc.

    Abstract: An electronic device may have a display. The display may include an array of pixels formed on a silicon substrate. Display driver circuitry may be formed in a display driver integrated circuit that outputs display data and other control signals for operating the display. An interposer structure may be included in the electronic device. The interposer structure may be attached to the silicon display substrate and may only partially overlap the silicon display substrate. The display driver integrated circuit may be attached to the interposer structure and provide signals to the display pixels through the interposer structure. In another possible arrangement, the display driver integrated circuit may bridge a gap between the silicon display substrate and the flexible printed circuit. The display driver integrated circuit only partially overlaps the silicon display substrate in this arrangement.

    Hybrid Displays
    5.
    发明公开
    Hybrid Displays 审中-公开

    公开(公告)号:US20240081134A1

    公开(公告)日:2024-03-07

    申请号:US18329388

    申请日:2023-06-05

    Applicant: Apple Inc.

    Abstract: A hybrid display may include different display portions with different resolutions. The high resolution display portion may be positioned in a main viewing area for the viewer whereas the low resolution display portion may be positioned in a peripheral viewing area. The high resolution display portion may have a silicon backplane. The low resolution display portion may have a different type of backplane such as a thin-film transistor backplane. The different display portions may optionally share a common organic light-emitting diode layer such that light is emitted from the same plane across both display portions. The high resolution display portion may emit light through a transparent window in the low resolution display portion. A high resolution display may also be formed by separately forming a frontplane and a backplane. Conductive attachment structures such as indium bumps may be used to mechanically and electrically connect the backplane to the frontplane.

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