公开(公告)号：US20190072384A1

公开(公告)日：2019-03-07

申请号：US16122833

申请日：2018-09-05

Applicant: Apple Inc.

Inventor： David MACNEIL ,  William S. LEE ,  Eric N. NYLAND

IPC: G01C5/06 ,  G01L19/14 ,  G01L19/00

Abstract: Aspects of the subject technology relate to electronic devices with pressure sensors. A pressure sensor may be mounted within a device housing in a pressure sensor cavity at or near an opening in the housing. A barometric vent between a main cavity within the housing and the pressure sensor cavity allows pressure changes in the main cavity to generate airflow through the pressure sensor cavity and out through the opening in the device housing. The generated airflow may clear debris that has occluded the opening in the housing.

公开(公告)号：US20190025133A1

公开(公告)日：2019-01-24

申请号：US16040290

申请日：2018-07-19

Applicant: Apple Inc.

Inventor： William S. LEE ,  Tyler B. CATER ,  Shannon X. YANG ,  Justin D. CROSBY ,  Timothy S. LUI ,  Eric N. NYLAND

IPC: G01K7/02 ,  G01K1/16 ,  G06F3/02 ,  G06F3/041 ,  H04R3/04 ,  H04R1/10

Abstract: Aspects of the subject technology relate to electronic devices having sensors such as pressure sensors. A pressure sensor may be integrated into an audio component of an electronic device such that the pressure sensor is fluidly coupled to an environment external to a device housing via at least a portion of an internal cavity of the audio component housing. The audio component housing may include an opening. The pressure sensor may be mounted adjacent to or within the opening. The opening may be sealed to prevent passage of gas or liquid through the opening. The pressure sensor may be integrally formed with an inner wall of the audio component housing. The audio component may be a speaker or a microphone.