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公开(公告)号：US20160380663A1
公开(公告)日：2016-12-29
申请号：US15263259
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Ashutosh Y. SHUKLA , Tyler B. CATER , Sawyer I. COHEN , Edward S. HUO , David A. PAKULA , Benjamin Shane BUSTLE , Dhaval N. SHAH , Yaocheng ZHANG , Vivek KATIYAR
IPC: H04B1/3888 , H04M1/02
CPC classification number: H04B1/3888 , H01H13/06 , H01H2205/016 , H01H2207/032 , H01H2213/00 , H01H2213/002 , H01H2213/016 , H01H2223/002 , H04B2001/3894 , H04M1/0249 , H04M1/026 , H04M1/236
Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.
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公开(公告)号：US20190025133A1
公开(公告)日：2019-01-24
申请号：US16040290
申请日：2018-07-19
Applicant: Apple Inc.
Inventor： William S. LEE , Tyler B. CATER , Shannon X. YANG , Justin D. CROSBY , Timothy S. LUI , Eric N. NYLAND
Abstract: Aspects of the subject technology relate to electronic devices having sensors such as pressure sensors. A pressure sensor may be integrated into an audio component of an electronic device such that the pressure sensor is fluidly coupled to an environment external to a device housing via at least a portion of an internal cavity of the audio component housing. The audio component housing may include an opening. The pressure sensor may be mounted adjacent to or within the opening. The opening may be sealed to prevent passage of gas or liquid through the opening. The pressure sensor may be integrally formed with an inner wall of the audio component housing. The audio component may be a speaker or a microphone.
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公开(公告)号：US20180110143A1
公开(公告)日：2018-04-19
申请号：US15593253
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.
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公开(公告)号：US20180070465A1
公开(公告)日：2018-03-08
申请号：US15454826
申请日：2017-03-09
Applicant: Apple Inc.
Inventor： Tyler B. CATER , Benjamin J. POPE , Scott A. MYERS , Benjamin Shane BUSTLE , Tseng-Mau YANG , Adam J. BRINKMAN
IPC: H05K5/02 , H01Q1/24 , H04B1/3827
CPC classification number: H05K5/0208 , G06F1/1626 , H01Q1/24 , H01Q1/243 , H01Q1/521 , H04B1/3827 , H04M1/0202 , H05K5/0217
Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.
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Patent Agency Ranking
公开(公告)号：US20170089383A1
公开(公告)日：2017-03-30
申请号：US15268233
申请日：2016-09-16
Applicant: Apple Inc.
Inventor： Edward S. HUO , Martin J. AUCLAIR , Scott A. MYERS , Michael B. WITTENBERG , Ashutosh Y. SHUKLA , Tyler B. CATER
CPC classification number: F16B31/021 , B29C65/48 , B29C65/562 , B29K2077/00 , B29L2031/3437 , B29L2031/727 , F16B11/008 , F16B31/00 , F16B33/02
Abstract: A fastener is disclosed. The fastener can be used to couple together two or more parts in an electronic device. The fastener may include a head coupled with a platform having a shaft extending from the platform. The head is coupled with the platform in a manner that allows the head to decouple from the platform. For example, the head is secured with the platform by an adhesive that provides an adhesive bonding force. In this regard, a rotational force applied to the head that is greater than the adhesive bonding force causes the head to decouple from the platform. The shaft may include several blades and several protrusions. The blades may be used to engage one of the parts. The protrusions may also engage the same part as the blades, and interlock with the part to provide a retaining force that prevents the fastener from decoupling from the parts.
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公开(公告)号：US20150064386A1
公开(公告)日：2015-03-05
申请号：US14254809
申请日：2014-04-16
Applicant: Apple Inc.
Inventor： Stefan C. MAG , Matthew D. HILL , Scott A. MYERS , Liane J. FANG , Tyler B. CATER
CPC classification number: B29C65/76 , B29C65/50 , B29C65/5057 , B29L2031/3481 , C09J7/00 , C09J7/10 , C09J2201/618 , C09J2203/326 , C09J2203/33 , C09J2421/00 , F16B11/006 , G06F1/1613 , H04M1/026 , H04M1/0262 , H04M1/0279 , H05K5/0086 , Y10T428/1476 , Y10T428/2419 , Y10T428/24273 , Y10T428/24777
Abstract: A stretch release adhesive is disclosed. The stretch release adhesive can be used for extracting an electrical component from an interior surface of a housing of a mobile computing device. The stretch release adhesive can have a double-sided adhesive body configured to adhere the component to the interior surface of the housing. A portion of the double-sided adhesive body is configured to extend out from between the electrical component and the interior surface of the housing to provide a graspable portion. When the stretch release adhesive is adhered between the electrical component and the internal surface of the housing, the stretch release adhesive can receive a pulling force at the graspable portion. If pulled with enough force, the stretch release adhesive will extend outwardly from between the electrical component and the internal surface of the mobile computing device, then completely release the electrical component from the mobile computing device.
Abstract translation: 公开了一种拉伸剥离粘合剂。 拉伸剥离粘合剂可用于从移动计算设备的壳体的内表面提取电气部件。 拉伸剥离粘合剂可以具有双面粘合体，其构造成将部件粘附到壳体的内表面。 双面粘合体的一部分构造成从电气部件和壳体的内表面之间延伸出来，以提供可抓握部分。 当拉伸剥离粘合剂粘附在电气部件和壳体的内表面之间时，拉伸剥离粘合剂可以在可抓握部分处受到拉力。 如果用足够的力拉动，拉伸剥离粘合剂将从电气部件和移动计算设备的内表面之间向外延伸，然后从移动计算设备完全释放电气部件。
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公开(公告)号：US20190254185A1
公开(公告)日：2019-08-15
申请号：US16396456
申请日：2019-04-26
Applicant: Apple Inc.
Inventor： Tyler B. CATER , Benjamin J. POPE , Scott A. MYERS , Benjamin Shane BUSTLE , Tseng-Mau YANG , Adam J. BRINKMAN
CPC classification number: H05K5/0208 , B29C37/0085 , B29C45/14311 , B29C45/14467 , G06F1/1626 , H01Q1/24 , H01Q1/243 , H01Q1/521 , H04B1/3827 , H04M1/0202 , H04M1/0249 , H04M1/185 , H05K5/0217
Abstract: An electronic device having multiple housing components interlocked together by a molded material is disclosed. In order to provide interlocking surfaces for the molded material, the housing components can include various geometries designed to receive and retain the molded material such that the housing components are secured with one another. For example, a first housing part can undergo several material removal operations to form multiple ribs, each with through holes. When the molded material extends along the ribs and into the through holes, the molded material cures and interlocks with the first housing part. A second housing part can include several stepped indentions that receive the molded material. Also, a third housing part can include a dovetail indention to receive the molded material such that the first and second housing parts interlock with the third housing part. The indentions can provide retention in three dimensions to protect against decoupling.
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公开(公告)号：US20180109659A1
公开(公告)日：2018-04-19
申请号：US15593252
申请日：2017-05-11
Applicant: Apple Inc.
Inventor： Xiao Ying ZHAO , Timothy S. LUI , Tyler B. CATER , Rasamy PHOUTHAVONG , Scott A. MYERS , Benjamin J. POPE , David A. HURRELL , Christopher R. XYDIS , Edward S. HUO , Richard Hung Minh DINH , Michael W. FIRKA , Martin J. AUCLAIR , Kurtis J. MUNDELL , Salome BAVETTA , Paul LEUTHEUSER , Hani ESMAEILI , Kevin M. FROESE , Ihtesham H. CHOWDHURY , Tang Yew TAN , Eric W. BATES , Yaocheng ZHANG
CPC classification number: H05K5/0217 , G06F1/1626 , G06F1/1633 , G06F1/1684 , G06F1/1698 , H01H9/04 , H04B1/3816 , H04M1/0249 , H04M1/026 , H04M1/18 , H04R1/025 , H04R1/44 , H04R2499/11 , H05K7/1461
Abstract: An electronic device having liquid-resistant modifications that prevent liquid ingress into an opening (or openings) in an enclosure of the electronic device is disclosed. For example, the electronic device may include a coating formed from a liquid-resistant material that is applied internally to the enclosure. The electronic device may further include a frame that carries a protective transparent layer designed to cover a display assembly. In order to secure the frame with the enclosure, the electronic device may include an adhesive assembly disposed over an outer perimeter of the coating. The adhesive assembly may include several adhesive parts initially separate from one another. However, with the adhesive parts between the frame and the enclosure, the adhesive parts can be compressed by the frame and the enclosure, causing the adhesive parts to expand and engage each other. As a result, the coating and the adhesive parts provide a seal against liquid.
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公开(公告)号：US20170047959A1
公开(公告)日：2017-02-16
申请号：US15236157
申请日：2016-08-12
Applicant: Apple Inc.
Inventor： Tyler B. CATER , Derek C. KRASS , Rasamy PHOUTHAVONG
IPC: H04B1/3888 , H04M1/02 , H05K5/06
CPC classification number: H04B1/3888 , H04B2001/3894 , H04M1/0249 , H04M1/18
Abstract: An electronic device having an enclosure with a sealing element to prevent ingress of contaminants at an interface between sealing element and a material is disclosed. The material may include an injection molded material that forms at least part of a radio frequency transparent window. The enclosure may include a first channel that receives the material. A second channel may open to the first channel and receive the sealing element. The sealing element may initially extend at least partially into the first channel. However, the material may provide compression forces to the sealing element to compress the sealing element out of the first channel, or at least compress the sealing element further into the second channel. The sealing element may provide a counterforce against the material to increase or enhance a seal against ingress attempting to pass through the enclosure at the interface between sealing element and the material.
Abstract translation: 公开了一种电子设备，其具有具有密封元件的外壳，以防止在密封元件和材料之间的界面处的污染物进入。 材料可以包括形成射频透明窗口的至少一部分的注射成型材料。 外壳可以包括接收材料的第一通道。 第二通道可以打开到第一通道并接收密封元件。 密封元件可以最初至少部分地延伸到第一通道中。 然而，材料可以向密封元件提供压缩力，以将密封元件压出第一通道，或者至少将密封元件压缩成第二通道。 密封元件可以提供抵抗材料的反作用力，以增加或增强密封，以防止试图在密封元件和材料之间的界面处通过外壳的入口。
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