公开(公告)号：US20210258698A1

公开(公告)日：2021-08-19

申请号：US16792043

申请日：2020-02-14

Applicant: Apple Inc.

Inventor： Florence W. OW ,  Peter C. HRUDEY ,  Yu-Chun HSU ,  Anthony D. MINERVINI ,  John K. QUEENEY ,  Tavys Q. ASHCROFT

IPC: H04R19/04 ,  H04R1/04 ,  H04R7/04 ,  H04R7/16

Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.