公开(公告)号：US20230262372A1

公开(公告)日：2023-08-17

申请号：US17670347

申请日：2022-02-11

Applicant: Apple Inc.

Inventor： Anthony D. MINERVINI ,  Peter C. HRUDEY ,  Gokhan HATIPOGLU

IPC: H04R1/08 ,  H04R1/04

CPC classification number: H04R1/08 ,  H04R1/04

Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.

公开(公告)号：US20240114277A1

公开(公告)日：2024-04-04

申请号：US18537741

申请日：2023-12-12

Applicant: Apple Inc.

Inventor： Anthony D. MINERVINI ,  Peter C. HRUDEY ,  Gokhan HATIPOGLU

IPC: H04R1/08 ,  H04R1/04

CPC classification number: H04R1/08 ,  H04R1/04

Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.

公开(公告)号：US20230379609A1

公开(公告)日：2023-11-23

申请号：US18144789

申请日：2023-05-08

Applicant: Apple Inc.

Inventor： Scott C. GRINKER ,  Ali N. ERGUN ,  Anthony D. MINERVINI ,  Claudio NOTARANGELO ,  Matthew A. DONARSKI

IPC: H04R1/04 ,  H04R1/08 ,  H04R1/02

CPC classification number: H04R1/04 ,  H04R1/083 ,  H04R1/025 ,  H04R2499/11 ,  H04R2400/11

Abstract: Implementations of the subject technology provide for a microphone in the front volume of a speaker. The speaker and the microphone may be provided in a single speaker assembly. The microphone may be implemented as an error microphone or a feedback microphone. The microphone may be mounted to a speaker frame of the speaker, with a sound-sensitive element of the microphone in the front volume of the speaker on a first side of the speaker frame, and with conductive contacts for the microphone disposed on an opposing second side of the speaker frame.

公开(公告)号：US20230262370A1

公开(公告)日：2023-08-17

申请号：US17670387

申请日：2022-02-11

Applicant: Apple Inc.

Inventor： Anthony D. MINERVINI ,  Peter C. HRUDEY ,  Gokhan HATIPOGLU

IPC: H04R1/02 ,  B81B7/02 ,  H04R1/28

CPC classification number: H04R1/023 ,  B81B7/02 ,  H04R1/2803 ,  H04R1/2873 ,  B81B2201/0257 ,  H04R2499/11

Abstract: Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.

公开(公告)号：US20210258698A1

公开(公告)日：2021-08-19

申请号：US16792043

申请日：2020-02-14

Applicant: Apple Inc.

Inventor： Florence W. OW ,  Peter C. HRUDEY ,  Yu-Chun HSU ,  Anthony D. MINERVINI ,  John K. QUEENEY ,  Tavys Q. ASHCROFT

IPC: H04R19/04 ,  H04R1/04 ,  H04R7/04 ,  H04R7/16

Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.