ACCESSORY DEVICE FOR AN ELECTRONIC DEVICE
    1.
    发明申请

    公开(公告)号:US20200241598A1

    公开(公告)日:2020-07-30

    申请号:US16848335

    申请日:2020-04-14

    Applicant: Apple Inc.

    Abstract: Electronic devices and accessory devices for electronic devices are described. In some instances, an accessory device includes a keyboard and a cover rotatable with respect to the keyboard. In some instances, an accessory device includes a back panel and a foldable cover rotatable with respect to the back panel. These accessory devices may include several magnetic elements designed to magnetically couple with, and retain, an electronic device without any additional mechanical or other interlocking devices. In this regard, the magnetic elements in the accessory devices provide an external magnetic field sufficiently strong enough to retain the electronic device, and can counter gravitational forces and/or the weight of the electronic device. However, some accessory devices include additional magnetic elements that provide an external magnetic field that repels magnetic elements in the electronic device. Also, the magnetic elements may also be used to hold different sections of the accessory device together.

    SENSOR ASSEMBLY FOR ELECTRONIC DEVICE

    公开(公告)号:US20210258698A1

    公开(公告)日:2021-08-19

    申请号:US16792043

    申请日:2020-02-14

    Applicant: Apple Inc.

    Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

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