公开(公告)号：US10406634B2

公开(公告)日：2019-09-10

申请号：US14788897

申请日：2015-07-01

Applicant: Apple Inc.

Inventor： Michael M. Li ,  Palaniappan Chinnakaruppan ,  Yulei Sun ,  Phillip W. Hum ,  Marwan Rammah

IPC: B23K26/402 ,  B23K26/38 ,  B23K26/18 ,  B23K26/0622 ,  B23K26/361 ,  B23K103/00

Abstract: A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.

公开(公告)号：US10537963B2

公开(公告)日：2020-01-21

申请号：US14575754

申请日：2014-12-18

Applicant: APPLE INC.

Inventor： Michael M. Li ,  Anthony J. Richter ,  Yulei Sun ,  Raul A. Molina

IPC: B23K26/00

Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

公开(公告)号：US20170001266A1

公开(公告)日：2017-01-05

申请号：US14788897

申请日：2015-07-01

Applicant: Apple Inc.

Inventor： Michael M. Li ,  Palaniappan Chinnakaruppan ,  Yulei Sun ,  Phillip W. Hum ,  Marwan Rammah

IPC: B23K26/402 ,  B23K26/38

CPC classification number: B23K26/38 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/361 ,  B23K26/402 ,  B23K2103/52

Abstract: A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.

Abstract translation: 使用基于激光的工艺来照射诸如蓝宝石的陶瓷材料以形成切割。 在一些实施方式中，可以加热与切割件相邻的陶瓷材料的区域。 可以移除该区域以形成边缘特征。 在各种实施方案中，与切割件相邻的陶瓷材料的区域可以使用诸如聚乙烯薄膜的屏蔽件与基于激光的工艺中使用的激光束的外部部分屏蔽。 这种去除和/或屏蔽操作可以提高陶瓷材料的机械强度。

公开(公告)号：US20150298251A1

公开(公告)日：2015-10-22

申请号：US14575754

申请日：2014-12-18

Applicant: APPLE INC.

Inventor： Michael M. Li ,  Anthony J. Richter ,  Yulei Sun ,  Raul A. Molina

IPC: B23K26/00

Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

Abstract translation: 一种形成蓝宝石部件的系统和方法。 该方法可以包括在蓝宝石衬底的第一表面上设置吸收阻挡层，使用入射到吸收阻挡层上的激光束在蓝宝石衬底中进行切割，以及从切割中形成和去除熔融蓝宝石。 该方法还可以包括使用吸收阻挡层屏蔽与熔融蓝宝石的切割相邻的第一表面的区域，以及从蓝宝石衬底的第一表面去除吸收阻挡层。