公开(公告)号：US20240342826A1

公开(公告)日：2024-10-17

申请号：US18577707

申请日：2022-07-07

Applicant: UNIVERSITÉ D'AIX-MARSEILLE ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： David GROJO ,  Andong WANG ,  Amlan DAS

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/352 ,  B23K26/402 ,  B23K101/40

CPC classification number: B23K26/0624 ,  B23K26/0626 ,  B23K26/352 ,  B23K26/402 ,  B23K2101/40

Abstract: The invention relates to an optical writing method in a semiconductor material (10), the method comprising laser writing in volume of the semiconductor material. The method comprises, prior to laser writing, irradiating the semiconductor material (10) with at least one laser pre-pulse configured to change transiently and locally one property of the semiconductor material (10).

公开(公告)号：US12098462B2

公开(公告)日：2024-09-24

申请号：US17309452

申请日：2019-11-27

Applicant: AIXTRON SE

Inventor： Marcel Kollberg ,  Francisco Ruda Y Witt

IPC: C23C16/455 ,  B23K26/364 ,  B23K26/382 ,  B23K26/402 ,  B23K103/00

CPC classification number: C23C16/45508 ,  B23K26/364 ,  B23K26/389 ,  B23K26/402 ,  B23K2103/52 ,  B23K2103/54

Abstract: A component made of a quartz blank is used as a component part of a CVD reactor. At least one cavity of the component is created by selective laser etching, wherein a fluid flows through the at least one cavity. When in use, the component is heated to temperatures in excess of 500° C., and comes into contact with hydrides of the main groups IV, V or VI and/or with organometallic compounds or halogenides of elements of the main groups II, III or V.

公开(公告)号：US12094742B2

公开(公告)日：2024-09-17

申请号：US17448072

申请日：2021-09-20

Applicant: DISCO CORPORATION

Inventor： Yoshinobu Saito ,  Yoshinori Kakinuma

IPC: H01L21/683 ,  B23K26/364 ,  B23K26/402 ,  B23K103/00 ,  B65G47/91 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67346 ,  B23K26/364 ,  B23K26/402 ,  B65G47/911 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/6838 ,  B23K2103/56 ,  B65G2201/0297

Abstract: A processing apparatus includes a wafer unloading unit, a wafer table, a frame unloading unit, a frame table, a tape affixing unit, a tape-affixed frame transporting unit, a tape compression-bonding unit, a frame unit unloading unit that unloads a frame unit in which a tape of a tape-affixed frame and the undersurface of a wafer are compression-bonded to each other from the wafer table, a reinforcing portion removing unit, a no-ring unit unloading unit, and a frame cassette table.

公开(公告)号：US12070422B2

公开(公告)日：2024-08-27

申请号：US17210113

申请日：2021-03-23

Applicant: Allotex, Inc.

Inventor： David Muller

IPC: A61F9/008 ,  B23K26/12 ,  B23K26/361 ,  B23K26/38 ,  B23K26/402 ,  A61F2/14 ,  B23K103/00

CPC classification number: A61F9/00804 ,  A61F9/0081 ,  A61F9/00812 ,  A61F9/00831 ,  A61F9/00834 ,  B23K26/127 ,  B23K26/361 ,  B23K26/38 ,  B23K26/402 ,  A61F2/145 ,  A61F2009/00842 ,  A61F2009/00851 ,  A61F2009/00872 ,  A61F2009/00878 ,  A61F2009/00893 ,  A61F2009/00895 ,  B23K2103/32

Abstract: A system for forming a corneal implant includes a cutting apparatus, which includes a laser source that emits a laser and optical elements that direct the laser. The system includes a controller implemented with at least one processor and at least one data storage device. The controller generates a sculpting plan for modifying a first shape of a lenticule formed from corneal tissue and achieving a second shape for the lenticule to produce a corneal implant with a refractive profile to reshape a recipient eye. The sculpting plan is determined from measurements relating to the lenticule having the first shape and information relating to a refractive profile for a corneal implant. The controller controls the cutting apparatus to direct, via the one or more optical elements, the laser from the laser source to sculpt the lenticule according to the sculpting plan to produce the corneal implant with the refractive profile.

公开(公告)号：US12059749B2

公开(公告)日：2024-08-13

申请号：US17364657

申请日：2021-06-30

Applicant: NICHIA CORPORATION

Inventor： Naoki Eboshi ,  Hiroaki Yuto

IPC: B23K26/364 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/359 ,  B23K26/402 ,  F21K9/64 ,  F21K9/90 ,  B23K101/36 ,  B23K103/00 ,  F21Y115/30

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/359 ,  B23K26/402 ,  F21K9/64 ,  F21K9/90 ,  B23K2101/36 ,  B23K2103/52 ,  F21Y2115/30

Abstract: A wavelength conversion member manufacturing method includes: providing the wavelength conversion member having an upper surface, the wavelength conversion member including a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength conversion member, at least one depressed portion each having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above more than once to form a plurality of continuous machining marks at different processing depths.

公开(公告)号：US12037281B2

公开(公告)日：2024-07-16

申请号：US16639481

申请日：2018-10-12

Applicant: LG CHEM, LTD.

Inventor： Bu Won Son ,  Jin Soo Lee ,  Jin Mi Jung ,  Bu Gon Shin

IPC: C03C15/00 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/364 ,  B23K26/402 ,  B23K26/57 ,  B29C65/00 ,  B32B3/30 ,  B32B17/10 ,  C03B33/07 ,  C03B33/09 ,  C03C27/06

CPC classification number: C03C15/00 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/364 ,  B23K26/402 ,  B23K26/57 ,  B29C66/30325 ,  B32B3/30 ,  B32B17/10036 ,  B32B17/10146 ,  B32B17/1055 ,  C03B33/07 ,  C03B33/091 ,  C03C27/06 ,  B32B2250/03 ,  B32B2250/40

Abstract: Provided is a method of manufacturing a heterogeneous material joined body, the method comprising irradiating a surface of a glass layer with a first laser to form two or more etched lines on the surface of the glass layer; providing a resin layer on the surface of the glass layer having the two or more etched lines; and irradiating the surface of the glass layer with the resin layer with a second laser to fill the etched lines and the surface of the glass layer with the resin layer and join the resin layer and the glass layer, wherein the glass layer having the two or more etched lines is irradiated with the second laser in a direction from the glass layer to the resin layer with focus on the surface of the glass layer which is in contact with the resin layer.

公开(公告)号：US20240181573A1

公开(公告)日：2024-06-06

申请号：US18439405

申请日：2024-02-12

Applicant: GENUINE SOLUTIONS PTE. LTD.

Inventor： Sardjono CHAINUR ,  Zhongke WANG

IPC: B23K26/402 ,  B23K26/0622 ,  B23K26/10 ,  B23K26/70

CPC classification number: B23K26/402 ,  B23K26/0622 ,  B23K26/10 ,  B23K26/703

Abstract: The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be split into two beams for dual focal spots used in the high speed cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed.

公开(公告)号：US11999015B2

公开(公告)日：2024-06-04

申请号：US17099073

申请日：2020-11-16

Applicant: NPS CO., LTD.

Inventor： Seong Ho Bae

IPC: B23K26/38 ,  B23K26/08 ,  B23K26/402 ,  G02B5/30

CPC classification number: B23K26/38 ,  B23K26/0846 ,  B23K26/0869 ,  B23K26/402 ,  G02B5/3025

Abstract: Disclosed herein is a film cutting system for dividing and forming a film sheet having a predetermined unit width and unit length from a raw film by laser cutting of the raw film. The film cutting system includes: a supply unit configured to intermittently supply the raw film by a predetermined unit supply length in a length direction of the raw film; a first laser unit including first and second laser nozzles each configured to radiate a laser beam onto the raw film, and a first head driver configured to convey the first laser nozzle and the second laser nozzle in a width direction of the raw film perpendicular to the length direction in a reciprocating manner; and a second laser unit including a laser nozzle disposed spaced apart from the first laser unit by the unit length in the length direction and configured to radiate a laser beam onto the raw film, and a second head driver configured to convey the laser nozzle in the width direction in a reciprocating manner, wherein, when the raw film is supplied by the supply unit, the first head driver dispose the first laser nozzle and the second laser nozzle so as to be spaced apart from each other by the unit width, and each of the first laser nozzle and the second laser nozzle radiates, in the length direction, the laser beam onto the raw film supplied by the supply unit to slit the raw film, and wherein, when the slitting of the raw film is completed, the supply unit stops supplying the raw film; the first head driver conveys one of the first laser nozzle and the second laser nozzle in the width direction; the second head driver conveys the laser nozzle in the width direction; and the one of the first laser nozzle and the second laser nozzle and the laser nozzle respectively radiate the laser beam onto the raw film in the width direction to cut the raw film to divide and form the film sheet from the raw film.

公开(公告)号：US20240058899A1

公开(公告)日：2024-02-22

申请号：US18499716

申请日：2023-11-01

Applicant: Siltectra GmbH

Inventor： Jan Richter ,  Christian Beyer ,  Ralf Rieske

IPC: B23K26/53 ,  B23K26/40 ,  B23K26/402 ,  B28D5/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/78

CPC classification number: B23K26/53 ,  B23K26/40 ,  B23K26/402 ,  B28D5/0011 ,  H01L21/02019 ,  H01L21/3043 ,  H01L21/78 ,  B23K2103/56

Abstract: A method for producing a detachment region in a solid-state body includes: providing a solid body that consists of a chemical compound comprising a combination of elements from the 3rd, 4th and 5th main group and subgroup 12 of the Periodic Table of the Elements; providing a laser light source; and exposing the solid body to laser beams from the laser light source. The laser beams penetrate into the solid body via a main surface of the solid body and are applied in a defined manner on a predefined portion of the solid body within the solid body to form a detachment region. The application of the laser beams successively creates multiple modifications in a crystal lattice of the solid body which, as a result of the modifications, fissures in a subcritical manner at least in a portion in each case in regions that surround the modifications.

公开(公告)号：US11897218B2

公开(公告)日：2024-02-13

申请号：US16968536

申请日：2018-11-16

Applicant: The Yokohama Rubber Co., LTD.

Inventor： Mitsuo Tsuji ,  Yoshinori Izumi

IPC: B29D30/06 ,  B23K26/142 ,  B23K26/14 ,  B23K26/402 ,  B29C33/72 ,  B23K103/00 ,  B23K35/38

CPC classification number: B29D30/0662 ,  B23K26/142 ,  B23K26/1464 ,  B23K26/402 ,  B29C33/72 ,  B23K35/383 ,  B23K2103/30 ,  B29D2030/0663

Abstract: Provided are a cleaning device and a method for cleaning a vulcanization mold. At the time of cleaning a molding surface of a vulcanization mold by irradiating with a laser beam from a laser head, an inert gas is supplied from a supply nozzle and an irradiation range of the molding surface irradiated with the laser beam is brought into an atmosphere of the inert gas.