Coated substrate and process for cutting a coated substrate

    公开(公告)号:US10537963B2

    公开(公告)日:2020-01-21

    申请号:US14575754

    申请日:2014-12-18

    Applicant: APPLE INC.

    Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

    SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA
    2.
    发明申请
    SYSTEM AND METHOD FOR LASER CUTTING SAPPHIRE USING MULTIPLE GAS MEDIA 有权
    使用多种气体介质激光切割鲷鱼的系统和方法

    公开(公告)号:US20150209903A1

    公开(公告)日:2015-07-30

    申请号:US14168285

    申请日:2014-01-30

    Applicant: Apple Inc.

    Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

    Abstract translation: 一种用于制造蓝宝石部件的系统和方法。 获得用于进行激光切割操作的蓝宝石基板。 使用激光和第一气体介质沿着切割轮廓切割蓝宝石衬底。 第一气体介质基本上由惰性气体组成。 然后使用激光和第二气体介质在切割轮廓处或附近照射蓝宝石衬底。 第二气体介质与包含氧气的第一气体介质不同。

    COATED SUBSTRATE AND PROCESS FOR CUTTING A COATED SUBSTRATE
    3.
    发明申请
    COATED SUBSTRATE AND PROCESS FOR CUTTING A COATED SUBSTRATE 审中-公开
    涂覆基材和切割涂层基材的方法

    公开(公告)号:US20150298251A1

    公开(公告)日:2015-10-22

    申请号:US14575754

    申请日:2014-12-18

    Applicant: APPLE INC.

    Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

    Abstract translation: 一种形成蓝宝石部件的系统和方法。 该方法可以包括在蓝宝石衬底的第一表面上设置吸收阻挡层,使用入射到吸收阻挡层上的激光束在蓝宝石衬底中进行切割,以及从切割中形成和去除熔融蓝宝石。 该方法还可以包括使用吸收阻挡层屏蔽与熔融蓝宝石的切割相邻的第一表面的区域,以及从蓝宝石衬底的第一表面去除吸收阻挡层。

    MULTI-STEP CUTTING PROCESS
    4.
    发明申请
    MULTI-STEP CUTTING PROCESS 有权
    多步切割工艺

    公开(公告)号:US20140076299A1

    公开(公告)日:2014-03-20

    申请号:US13623595

    申请日:2012-09-20

    Applicant: APPLE INC.

    Abstract: Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.

    Abstract translation: 讨论了与蓝宝石有效处理有关的方法,其预期将用于快速制造用于应用的刚玉并且使得难以实现成本效益。 特别地,一个实施例可以采取切割具有抛光表面的硬质透明材料的方法的形式。 该方法包括使抛光表面粗糙化,将激光束导向硬透明材料以熔化材料并除去熔融的硬质材料。

    Multi-step cutting process
    6.
    发明授权
    Multi-step cutting process 有权
    多步切割过程

    公开(公告)号:US09120179B2

    公开(公告)日:2015-09-01

    申请号:US13623595

    申请日:2012-09-20

    Applicant: Apple Inc.

    Abstract: Methods related to efficient processing of sapphire are discussed which are expected to both speed manufacture of corundum for applications and make the use of conundrum cost effective. In particular, one embodiment may take the form of a method of cutting a hard transparent material having a polished surface. The method includes roughening the polished surface, directing a laser beam at the hard transparent material to melt the material and removing the melted hard material.

    Abstract translation: 讨论了与蓝宝石有效处理有关的方法,其预期将用于快速制造用于应用的刚玉并且使得难以实现成本效益。 特别地,一个实施例可以采取切割具有抛光表面的硬质透明材料的方法的形式。 该方法包括使抛光表面粗糙化,将激光束导向硬透明材料以熔化材料并除去熔融的硬质材料。

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