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公开(公告)号:US11289997B1
公开(公告)日:2022-03-29
申请号:US16894283
申请日:2020-06-05
Applicant: Apple Inc.
Inventor: Paul M. White , Mark H. Sherwood , Stephen M. Spiteri , Zachary M. Rubin
IPC: H03K17/06 , H02M1/32 , G01R31/40 , G01R31/50 , H02H3/05 , G11C17/18 , H02H3/20 , H02M11/00 , H02M1/00
Abstract: Aspects of the present disclosure involve a power module, which may include an inverter circuit employing semiconductor switch dies. In the presence of a failure of a die, which may include an arc from a short, a sensor produces a signal responsive to the failure. The signal initiates an indirect fuse, such as a pyrotechnic element, that opens conductors associated with the die. For example, the die or a related die may be wire bonded to terminals of the module. The indirect element may therefore open the bonds to the terminals to isolate the failed die and/or related dies.
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公开(公告)号:US11251622B1
公开(公告)日:2022-02-15
申请号:US15454324
申请日:2017-03-09
Applicant: Apple Inc.
Inventor: Mark H. Sherwood , Paul M. White , Dillon J. Thomasson , Zachary M. Rubin , Stephen M. Spiteri , Javier Ruiz
Abstract: Aspects of the present disclosure involve an inverter employing switches of different types in parallel. In one example, an apparatus includes a voltage-source converter that may have a plurality of switch positions collectively coupled to convert an input to an output. At least one switch position may include a first switch of a first switch type and a second switch of a second switch type different from the first switch type. Also, the first and second switches may be coupled in parallel. The converter may also include a switch control circuit to generate, for each of the at least one of the switch positions, a first control signal to operate the first switch of the switch position, and a second control signal to operate the second switch of the switch position.
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公开(公告)号:US10693363B1
公开(公告)日:2020-06-23
申请号:US15660627
申请日:2017-07-26
Applicant: Apple Inc.
Inventor: Paul M. White , Mark H. Sherwood , Stephen M. Spiteri , Zachary M. Rubin
IPC: H03K17/06 , H02M1/32 , G01R31/40 , G01R31/50 , H02M1/00 , H02M11/00 , H02H3/05 , H02H3/20 , G11C17/18
Abstract: Aspects of the present disclosure involve a power module, which may include an inverter circuit employing semiconductor switch dies. In the presence of a failure of a die, which may include an arc from a short, a sensor produces a signal responsive to the failure. The signal initiates an indirect fuse, such as a pyrotechnic element, that opens conductors associated with the die. For example, the die or a related die may be wire bonded to terminals of the module. The indirect element may therefore open the bonds to the terminals to isolate the failed die and/or related dies.
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