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公开(公告)号：US20230030746A1
公开(公告)日：2023-02-02
申请号：US17387093
申请日：2021-07-28
Applicant: Apple Inc.
Inventor： Ashish K. Sahoo , Brandon Pierquet , Derryk C. Davis , Javier Ruiz , John M. Brock
IPC: H01L29/20 , H01L23/31 , H01L23/36 , H01L23/14 , H01L23/522 , H01L23/532 , H01L27/088
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.
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公开(公告)号：US11862688B2
公开(公告)日：2024-01-02
申请号：US17387093
申请日：2021-07-28
Applicant: Apple Inc.
Inventor： Ashish K. Sahoo , Brandon Pierquet , Derryk C. Davis , Javier Ruiz , John M. Brock
IPC: H01L23/14 , H01L29/20 , H01L23/31 , H01L23/36 , H01L23/522 , H01L23/532 , H01L27/088
CPC classification number: H01L29/2003 , H01L23/14 , H01L23/31 , H01L23/36 , H01L23/5226 , H01L23/53228 , H01L27/088
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The integrated power modules may include one or more gallium nitride transistors coupled between and soldered to each of the second surface of the printed circuit board and the heat-transfer substrate. The integrated power modules may include one or more spacers coupled between and soldered to each of the printed circuit board and the heat-transfer substrate.
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公开(公告)号：US10924101B1
公开(公告)日：2021-02-16
申请号：US16705110
申请日：2019-12-05
Applicant: Apple Inc.
Inventor： Paul M. White , Javier Ruiz
Abstract: Power semiconductor devices according to embodiments of the present technology may be operated to protect components of the semiconductor device. Methods for operation of the devices may include measuring a temperature within a source region of the semiconductor device. The methods may include measuring at the semiconductor device an amount of current associated with a short circuit external to the semiconductor device. The methods may include predicting a temperature effect within two regions of the semiconductor device based on a range of distribution of the amount of current between the two regions of the semiconductor device. The methods may include determining a particular distribution of the amount of current between the two regions of the semiconductor device. The methods may also include shutting off the semiconductor device to cause the particular distribution of current between the two regions of the semiconductor device.
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公开(公告)号：US11251622B1
公开(公告)日：2022-02-15
申请号：US15454324
申请日：2017-03-09
Applicant: Apple Inc.
Inventor： Mark H. Sherwood , Paul M. White , Dillon J. Thomasson , Zachary M. Rubin , Stephen M. Spiteri , Javier Ruiz
Abstract: Aspects of the present disclosure involve an inverter employing switches of different types in parallel. In one example, an apparatus includes a voltage-source converter that may have a plurality of switch positions collectively coupled to convert an input to an output. At least one switch position may include a first switch of a first switch type and a second switch of a second switch type different from the first switch type. Also, the first and second switches may be coupled in parallel. The converter may also include a switch control circuit to generate, for each of the at least one of the switch positions, a first control signal to operate the first switch of the switch position, and a second control signal to operate the second switch of the switch position.
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