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公开(公告)号：US11289997B1
公开(公告)日：2022-03-29
申请号：US16894283
申请日：2020-06-05
Applicant: Apple Inc.
Inventor： Paul M. White , Mark H. Sherwood , Stephen M. Spiteri , Zachary M. Rubin
IPC: H03K17/06 , H02M1/32 , G01R31/40 , G01R31/50 , H02H3/05 , G11C17/18 , H02H3/20 , H02M11/00 , H02M1/00
Abstract: Aspects of the present disclosure involve a power module, which may include an inverter circuit employing semiconductor switch dies. In the presence of a failure of a die, which may include an arc from a short, a sensor produces a signal responsive to the failure. The signal initiates an indirect fuse, such as a pyrotechnic element, that opens conductors associated with the die. For example, the die or a related die may be wire bonded to terminals of the module. The indirect element may therefore open the bonds to the terminals to isolate the failed die and/or related dies.
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公开(公告)号：US11251622B1
公开(公告)日：2022-02-15
申请号：US15454324
申请日：2017-03-09
Applicant: Apple Inc.
Inventor： Mark H. Sherwood , Paul M. White , Dillon J. Thomasson , Zachary M. Rubin , Stephen M. Spiteri , Javier Ruiz
Abstract: Aspects of the present disclosure involve an inverter employing switches of different types in parallel. In one example, an apparatus includes a voltage-source converter that may have a plurality of switch positions collectively coupled to convert an input to an output. At least one switch position may include a first switch of a first switch type and a second switch of a second switch type different from the first switch type. Also, the first and second switches may be coupled in parallel. The converter may also include a switch control circuit to generate, for each of the at least one of the switch positions, a first control signal to operate the first switch of the switch position, and a second control signal to operate the second switch of the switch position.
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公开(公告)号：US10693363B1
公开(公告)日：2020-06-23
申请号：US15660627
申请日：2017-07-26
Applicant: Apple Inc.
Inventor： Paul M. White , Mark H. Sherwood , Stephen M. Spiteri , Zachary M. Rubin
IPC: H03K17/06 , H02M1/32 , G01R31/40 , G01R31/50 , H02M1/00 , H02M11/00 , H02H3/05 , H02H3/20 , G11C17/18
Abstract: Aspects of the present disclosure involve a power module, which may include an inverter circuit employing semiconductor switch dies. In the presence of a failure of a die, which may include an arc from a short, a sensor produces a signal responsive to the failure. The signal initiates an indirect fuse, such as a pyrotechnic element, that opens conductors associated with the die. For example, the die or a related die may be wire bonded to terminals of the module. The indirect element may therefore open the bonds to the terminals to isolate the failed die and/or related dies.
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公开(公告)号：US10924101B1
公开(公告)日：2021-02-16
申请号：US16705110
申请日：2019-12-05
Applicant: Apple Inc.
Inventor： Paul M. White , Javier Ruiz
Abstract: Power semiconductor devices according to embodiments of the present technology may be operated to protect components of the semiconductor device. Methods for operation of the devices may include measuring a temperature within a source region of the semiconductor device. The methods may include measuring at the semiconductor device an amount of current associated with a short circuit external to the semiconductor device. The methods may include predicting a temperature effect within two regions of the semiconductor device based on a range of distribution of the amount of current between the two regions of the semiconductor device. The methods may include determining a particular distribution of the amount of current between the two regions of the semiconductor device. The methods may also include shutting off the semiconductor device to cause the particular distribution of current between the two regions of the semiconductor device.
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