公开(公告)号：US20180269089A1

公开(公告)日：2018-09-20

申请号：US15461952

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Niraj MERCHANT ,  Lara HAWRYLCHAK ,  Mehran BEHDJAT ,  Dietrich GAGE ,  Christopher DAO ,  Binh NGUYEN ,  Michael P. KAMP ,  Mahesh RAMAKRISHNA

IPC: H01L21/67 ,  G01J5/34 ,  G01J5/00 ,  G01R35/00 ,  H05B1/02 ,  H05B3/00 ,  H01L21/66

Abstract: Embodiments of the disclosure relate to methods for measuring temperature and a tool for calibrating temperature control of a substrate support in a processing chamber without contact with a surface of the substrate support. In one embodiment, a test fixture with a temperature sensor is removably mounted to an upper surface of a chamber body of the processing chamber such that the temperature sensor has a field of view including an area of the substrate support that is adjacent to a resistive coil disposed in the substrate support. One or more calibration temperature measurements of the area of the substrate support are taken by the temperature sensor and simultaneously one or more calibration resistance measurements of the resistive coil are taken corresponding to each calibration temperature measurement. Temperature control of a heating element disposed in the substrate support is calibrated based on the calibration temperature and calibration resistance measurements.

公开(公告)号：US20190153592A1

公开(公告)日：2019-05-23

申请号：US16259011

申请日：2019-01-28

Applicant: Applied Materials, Inc.

Inventor： Dale Du BOIS ,  Mohamad A. AYOUB ,  Robert KIM ,  Amit Kumar BANSAL ,  Mark FODOR ,  Binh NGUYEN ,  Siu F. CHENG ,  Hang YU ,  Chiu CHAN ,  Ganesh BALASUBRAMANIAN ,  Deenesh PADHI ,  Juan Carlos ROCHA

IPC: C23C16/04 ,  C23C16/458 ,  C23C16/455 ,  C23C16/44 ,  H01J37/32 ,  C23C14/04 ,  H01L21/687 ,  C30B25/12 ,  H01J37/34

Abstract: Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.