公开(公告)号：US10978334B2

公开(公告)日：2021-04-13

申请号：US14602885

申请日：2015-01-22

Applicant: Applied Materials, Inc.

Inventor： Chin Hock Toh ,  Tuck Foong Koh ,  Sriskantharajah Thirunavukarasu ,  Jen Sern Lew ,  Arvind Sundarrajan ,  Seshadri Ramaswami

IPC: H01L21/687 ,  C23C16/458 ,  H01J37/32 ,  H01L21/67

Abstract: A sealing structure is between a workpiece or substrate and a carrier for plasma processing. In one example, a substrate carrier has a top surface for holding a substrate, the top surface having a perimeter and a resilient sealing ridge on the perimeter of the top surface to contact the substrate when the substrate is being carried on the carrier.