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公开(公告)号：US10607870B2
公开(公告)日：2020-03-31
申请号：US15291762
申请日：2016-10-12
Applicant: APPLIED MATERIALS, INC.
Inventor： Jen Sern Lew , Sriskantharajah Thirunavukarasu
IPC: B25B11/00 , H01L21/673 , H01L21/67 , H01L21/687 , H01L21/683
Abstract: Embodiments of substrate carriers which enable active/passive bonding and de-bonding of a substrate are provided herein. In some embodiments, a substrate carrier for holding a substrate comprises a disk formed of a porous material, the disk being formed symmetrically about a central axis and defining a substantially planar upper surface. In some embodiments, the porous material is silicon carbide and the substrate carrier includes a semi-porous surface coating formed atop the upper surface of the disk.
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公开(公告)号：US09993853B2
公开(公告)日：2018-06-12
申请号：US14556085
申请日：2014-11-28
Applicant: APPLIED MATERIALS, INC.
IPC: B08B3/04 , B08B5/02 , B08B6/00 , H01L21/67 , H01L21/683
CPC classification number: B08B5/02 , B08B6/00 , H01L21/67028 , H01L21/6831 , H01L21/6838
Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.
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Patent Agency Ranking
公开(公告)号：US10549324B2
公开(公告)日：2020-02-04
申请号：US15974000
申请日：2018-05-08
Applicant: APPLIED MATERIALS, INC.
Inventor： Sriskantharajah Thirunavukarasu , Jen Sern Lew , Arvind Sundarrajan , Srinivas Nemani
IPC: H01L21/67 , B08B5/02 , B08B6/00 , H01L21/683
Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.
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公开(公告)号：US09818624B2
公开(公告)日：2017-11-14
申请号：US15142220
申请日：2016-04-29
Applicant: APPLIED MATERIALS, INC.
Inventor： Jen Sern Lew , Tuck Foong Koh , Sriskantharajah Thirunavukarasu , Karthik Elumalai , Eng Sheng Peh , Jun-Liang Su
CPC classification number: H01L21/3247 , F27B9/02 , F27B9/10 , F27B17/0025 , H01L21/67109 , H01L21/67248 , H01L21/67288
Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.
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公开(公告)号：US11111583B2
公开(公告)日：2021-09-07
申请号：US15827845
申请日：2017-11-30
Applicant: APPLIED MATERIALS, INC.
Inventor： Sriskantharajah Thirunavukarasu , Karthik Elumalai , Jen Sern Lew , Mingwei Zhu
IPC: C23C16/458 , H01L21/683 , H01L21/687 , C23C16/30
Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.
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公开(公告)号：US10978334B2
公开(公告)日：2021-04-13
申请号：US14602885
申请日：2015-01-22
Applicant: Applied Materials, Inc.
Inventor： Chin Hock Toh , Tuck Foong Koh , Sriskantharajah Thirunavukarasu , Jen Sern Lew , Arvind Sundarrajan , Seshadri Ramaswami
IPC: H01L21/687 , C23C16/458 , H01J37/32 , H01L21/67
Abstract: A sealing structure is between a workpiece or substrate and a carrier for plasma processing. In one example, a substrate carrier has a top surface for holding a substrate, the top surface having a perimeter and a resilient sealing ridge on the perimeter of the top surface to contact the substrate when the substrate is being carried on the carrier.
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公开(公告)号：US09845533B2
公开(公告)日：2017-12-19
申请号：US14538769
申请日：2014-11-11
Applicant: APPLIED MATERIALS, INC.
Inventor： Sriskantharajah Thirunavukarasu , Karthik Elumalai , Jen Sern Lew , Mingwei Zhu
IPC: H01L21/683 , C23C16/458 , H01L21/687 , C23C16/30
CPC classification number: C23C16/4586 , C23C16/303 , H01L21/6831 , H01L21/68771
Abstract: Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.
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