公开(公告)号：US10002711B2

公开(公告)日：2018-06-19

申请号：US14970228

申请日：2015-12-15

Applicant: Applied Materials, Inc.

Inventor： Dapeng Wang ,  Yixuan Wu ,  Gaku Furuta ,  Tae Kyung Won ,  Beom Soo Park

IPC: H05K7/00 ,  H05K5/00 ,  H01G4/06 ,  H01G4/30 ,  H01G4/012 ,  H05K1/16

CPC classification number: H01G4/06 ,  H01G4/012 ,  H01G4/085 ,  H01G4/30 ,  H05K1/162 ,  H05K2201/0195

Abstract: The present disclosure generally relates to capacitors having a multilayer dielectric material between two electrodes. The multilayer dielectric material can have a small thickness with little to no breakdown strength reduction. By utilizing a multilayer dielectric structure in a capacitor, not only can the breakdown strength remain at an acceptable level, but the collective thickness of the capacitor may be reduced to accommodate the higher density pixels for display devices or any device that utilizes a capacitor.