公开(公告)号：US11964343B2

公开(公告)日：2024-04-23

申请号：US17183777

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Mahendran Chidambaram ,  Shmuel Erez ,  Wei-Sheng Lei ,  John Rusconi

IPC: B23K26/362 ,  B23K26/06 ,  B23K103/00

CPC classification number: B23K26/362 ,  B23K26/0643 ,  B23K26/0648 ,  B23K2103/50

Abstract: A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.