公开(公告)号：US11964343B2

公开(公告)日：2024-04-23

申请号：US17183777

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Mahendran Chidambaram ,  Shmuel Erez ,  Wei-Sheng Lei ,  John Rusconi

IPC: B23K26/362 ,  B23K26/06 ,  B23K103/00

CPC classification number: B23K26/362 ,  B23K26/0643 ,  B23K26/0648 ,  B23K2103/50

Abstract: A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.

公开(公告)号：US11203153B2

公开(公告)日：2021-12-21

申请号：US16653912

申请日：2019-10-15

Applicant: Applied Materials, Inc.

Inventor： Erez Shmuel ,  Mahendran Chidambaram

IPC: B29C64/25 ,  B29C64/255 ,  B29C64/245 ,  B33Y30/00 ,  B29C64/153

Abstract: A powder bin for an additive manufacturing apparatus has a plurality of walls forming an annular body to surround a build plate. The plurality of walls include an annular outer wall and an annular inner wall that are separated by a cavity, and a gap between a top edge of the inner wall and a top edge of the outer wall is configured to receive powder between the top edges of the outer walls and the inner walls. The annular body has an aperture that extends laterally through the inner wall and outer wall. A base is connected to a bottom edge of the outer wall and a bottom edge of the inner wall, and the base includes one or more ports. A sloped barrier is positioned in the cavity configured to direct powder around the aperture to the one or more ports in the base.

公开(公告)号：US20220362995A1

公开(公告)日：2022-11-17

申请号：US17869721

申请日：2022-07-20

Applicant: Applied Materials, Inc.

Inventor： Dakshalkumar Patel ,  Girish Kumar Chaturvedi ,  Bahubali S. Upadhye ,  Sumedh Acharya ,  Mahendran Chidambaram ,  Nilesh Chimanrao Bagul

IPC: B29C64/205 ,  B29C64/264 ,  B29C64/245 ,  B29C64/255 ,  B29C64/241

Abstract: An additive manufacturing apparatus includes an environmentally sealed first chamber, a second chamber separated from the first chamber by a first valve, a platform positionable in the first chamber, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform in the first chamber, at least one energy source to selectively fuse feed material in a layer on the platform in the first chamber, and an air knife assembly to direct a laminar flow of air across a layer of feed material on the platform in the first chamber. The air knife assembly includes an inlet module and an exhaust module that are movable through the first valve between the first chamber and the second chamber.

公开(公告)号：US20220305588A1

公开(公告)日：2022-09-29

申请号：US17655629

申请日：2022-03-21

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Mahendran Chidambaram ,  Kangkang Wang ,  Ludovic Godet ,  Visweswaren Sivaramakrishnan

IPC: B23K26/364 ,  B23K26/40 ,  B23K26/38

Abstract: Embodiments of the present disclosure relate to methods for dicing one or more optical devices from a substrate with a laser machining system. The laser machining system utilizes a laser to perform methods for dicing one or more optical devices from a substrate along a dicing path. The methods use one of forming a plurality of laser spots along the dicing path or forming a plurality of trenches along the dicing path.

公开(公告)号：US11413817B2

公开(公告)日：2022-08-16

申请号：US16684524

申请日：2019-11-14

Applicant: Applied Materials, Inc.

Inventor： Dakshalkumar Patel ,  Girish Kumar Chaturvedi ,  Bahubali S. Upadhye ,  Sumedh Acharya ,  Mahendran Chidambaram ,  Nilesh Chimanrao Bagul

IPC: B29C64/20 ,  B29C64/35 ,  B29C64/371 ,  B29C64/245 ,  B29C64/205 ,  B33Y30/00 ,  B33Y10/00 ,  B33Y40/00

Abstract: An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one energy source to selectively fuse feed material in a layer on the platform, and an air knife assembly. The air knife assembly includes an inlet unit to deliver gas over the platform and an exhaust unit to receive gas from over the platform. The inlet unit includes a multi-chamber plenum, a gas inlet, and a gas distribution module. The multi-chamber plenum has a plurality of vertically stacked chambers that are fluidically connected, with a first chamber of the plurality of vertically stacked chambers positioned at a higher elevation than a collection chamber of the plurality of vertically stacked chambers.

公开(公告)号：US20210107223A1

公开(公告)日：2021-04-15

申请号：US16653914

申请日：2019-10-15

Applicant: Applied Materials, Inc.

Inventor： Erez Shmuel ,  Mahendran Chidambaram

IPC: B29C64/255 ,  B29C64/245 ,  B29C64/232 ,  B29C64/264 ,  B29C64/205 ,  B33Y30/00

Abstract: An additive manufacturing apparatus includes an annular powder bin to surround a build plate, a support structure to hold the build plate in an interior of the powder bin, and a kinematic mount assembly for the support structure. The kinematic mount assembly includes at least three independently vertically kinematic mounts that support the support structure, and one or more actuators to independently control vertical motion of the kinematic mounts to control a tilt angle of the support structure and build plate.

公开(公告)号：US20210107222A1

公开(公告)日：2021-04-15

申请号：US16653912

申请日：2019-10-15

Applicant: Applied Materials, Inc.

Inventor： Erez Shmuel ,  Mahendran Chidambaram

IPC: B29C64/255 ,  B29C64/245

Abstract: A powder bin for an additive manufacturing apparatus has a plurality of walls forming an annular body to surround a build plate. The plurality of walls include an annular outer wall and an annular inner wall that are separated by a cavity, and a gap between a top edge of the inner wall and a top edge of the outer wall is configured to receive powder between the top edges of the outer walls and the inner walls. The annular body has an aperture that extends laterally through the inner wall and outer wall. A base is connected to a bottom edge of the outer wall and a bottom edge of the inner wall, and the base includes one or more ports. A sloped barrier is positioned in the cavity configured to direct powder around the aperture to the one or more ports in the base.

公开(公告)号：US12091349B2

公开(公告)日：2024-09-17

申请号：US17836162

申请日：2022-06-09

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng Lei ,  Mahendran Chidambaram ,  Kangkang Wang ,  Ludovic Godet ,  Visweswaren Sivaramakrishnan

IPC: B23K26/38 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/55 ,  C03B33/02 ,  C03B33/10 ,  C03C23/00 ,  B23K101/40 ,  B23K103/00

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0861 ,  B23K26/55 ,  C03B33/102 ,  C03C23/0025 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/54 ,  B23K2103/56 ,  B29C2791/009

Abstract: A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

公开(公告)号：US11878532B2

公开(公告)日：2024-01-23

申请号：US17647820

申请日：2022-01-12

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Ludovic Godet ,  Michael David-Scott Kemp ,  Kang Luo ,  Kazuya Daito ,  Kenneth S. Ledford ,  Bahubali S. Upadhye ,  Hemantha Raju ,  John Rusconi ,  Elsa Massonneau ,  Mahendran Chidambaram ,  Alexey Stepanov ,  Visweswaren Sivaramakrishnan

IPC: B41J2/175 ,  H01L21/00

CPC classification number: B41J2/175 ,  H01L21/00

Abstract: Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

公开(公告)号：US20210094234A1

公开(公告)日：2021-04-01

申请号：US16684524

申请日：2019-11-14

Applicant: Applied Materials, Inc.

Inventor： Dakshalkumar Patel ,  Girish Kumar Chaturvedi ,  Bahubali S. Upadhye ,  Sumedh Acharya ,  Mahendran Chidambaram ,  Nilesh Chimanrao Bagul

IPC: B29C64/35 ,  B29C64/245 ,  B29C64/205 ,  B29C64/268

Abstract: An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one energy source to selectively fuse feed material in a layer on the platform, and an air knife assembly. The air knife assembly includes an inlet unit to deliver gas over the platform and an exhaust unit to receive gas from over the platform. The inlet unit includes a multi-chamber plenum, a gas inlet, and a gas distribution module. The multi-chamber plenum has a plurality of vertically stacked chambers that are fluidically connected, with a first chamber of the plurality of vertically stacked chambers positioned at a higher elevation than a collection chamber of the plurality of vertically stacked chambers.