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Patent Agency Ranking
公开(公告)号：US20220362904A1
公开(公告)日：2022-11-17
申请号：US17321694
申请日：2021-05-17
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Uma SRIDHAR , Yingdong LUO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Sebastian David ROZO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: B24B37/24
Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.
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公开(公告)号：US20240227120A1
公开(公告)日：2024-07-11
申请号：US18204774
申请日：2023-06-01
Applicant: Applied Materials, Inc.
Inventor： Sudhakar MADHUSOODHANAN , Xinyi LU , Srikant PATHAK
CPC classification number: B24B37/24 , B24B37/22 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C08F20/06 , C08F20/36 , B29K2033/00
Abstract: The disclosure generally relates to polishing pads, methods of manufacturing polishing pads, and formulations for manufacturing polishing pads, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing. In one aspect, a photocurable printing composition containing photopolymerizable compounds and photopolymerization initiator is provided. The photocurable printing composition comprises a urethane acrylate oligomer having a functionality of 2 or more, a nominal viscosity greater than 20,000 cP at 60 degrees Celsius, and a glass transition temperature (Tg) of −4 degrees Celsius or greater, the urethane acrylate oligomer present from about 20% to about 60% by weight based on a total weight of the photopolymerizable compounds. The photocurable printing composition has a viscosity of 20 centipoise or higher at 70 degrees Celsius.
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公开(公告)号：US20250034296A1
公开(公告)日：2025-01-30
申请号：US18226962
申请日：2023-07-27
Applicant: Applied Materials, Inc.
Inventor： Xinyi LU , Srikant PATHAK , Sudhakar MADHUSOODHANAN
Abstract: Polishing pads having porogen-features, methods of manufacturing polishing pads having porogen features, and compositions for manufacturing polishing pads having porogen features, and more particularly, to polishing pads used for chemical mechanical polishing (CMP) of a substrate in electronic device processing are provided. In one aspect, the porogen-forming composition, in proportions based on a total weight of the porogen-forming composition, includes (A) from about 60 to about 80 wt. % of an acrylamide monomer compound selected from acryloylmorpholine, N, N-dimethylacrylamide, or a combination thereof. The curable porogen-forming composition further includes (B) from about 10 to about 40 wt. % of a polyhydroxy compound having two or more hydroxyl groups. The curable porogen-forming composition further includes (C) from about 0.2 wt. % to about 4 wt. % of a photoinitiator component.
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公开(公告)号：US20200325353A1
公开(公告)日：2020-10-15
申请号：US16668961
申请日：2019-10-30
Applicant: Applied Materials, Inc.
Inventor： Uma SRIDHAR , Sivapackia GANAPATHIAPPAN , Ashwin CHOCKALINGAM , Yingdong LUO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: C09D11/38 , B24B37/24 , C09D11/107 , C09D11/101 , B33Y70/00 , B33Y80/00
Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
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公开(公告)号：US20190337117A1
公开(公告)日：2019-11-07
申请号：US16375506
申请日：2019-04-04
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Ankit VORA , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.
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