PHOTOCURABLE RESINS WITH HIGH HEAT DEFLECTION TEMPERATURES

    公开(公告)号:US20250043056A1

    公开(公告)日:2025-02-06

    申请号:US18716539

    申请日:2022-12-07

    Applicant: BASF SE

    Abstract: Described herein are photopolymerizable compositions for use in 3D printing. The compositions contain highly crosslinkable acrylate monomers, oligomers comprising a polyether acrylate oligomer, a polyester oligomer, an unsaturated polyester oligomer, or a combination thereof and a photoinitiator. The compositions, after photopolymerization, have a high heat deflection temperature, while maintaining strong mechanical properties. Also described are methods for fabricating three dimensional objects utilizing these compositions, and three dimensional objects made from these compositions.

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