Low impedance fixed point test probe
    1.
    发明授权
    Low impedance fixed point test probe 失效
    低阻抗固定点测试探头

    公开(公告)号:US3702439A

    公开(公告)日:1972-11-07

    申请号:US3702439D

    申请日:1970-08-12

    CPC classification number: G01R1/07342

    Abstract: A test probe includes a picture frame insulator support member on which relatively short cantilever beam-like members are mounted. One end of each of the cantilever beam-like members is used as a probe to contact a beam lead or bonding pad of an integrated circuit chip which is part of a semiconductor wafer. The probe''s geometry, the material used for its construction, and the close proximity of the insulator support member to the integrated circuits to be tested all contribute to the low impedance of the probe and the sliding contact-type action which occurs during the probing operation.

    Abstract translation: 测试探针包括相框绝缘体支撑构件,其上安装相对较短的悬臂梁状构件。 每个悬臂梁状构件的一端用作探针,以接触作为半导体晶片的一部分的集成电路芯片的光束引线或焊盘。 探头的几何形状,用于其结构的材料以及绝缘体支撑构件与要测试的集成电路的紧密接近都有助于探针的低阻抗和在探测操作期间发生的滑动接触型作用。

    Laser machining method and apparatus
    2.
    发明授权
    Laser machining method and apparatus 失效
    激光加工方法和装置

    公开(公告)号:US3622742A

    公开(公告)日:1971-11-23

    申请号:US3622742D

    申请日:1970-05-27

    CPC classification number: B23K26/0823

    Abstract: Thin film integrated circuits are formed by coating insulative substrates with conductive film and mounting them on the periphery of a rotating drum. As the drum rotates, a switched laser machines the circuit pattern by vaporizing parts of the metal film of successive substrates. Light from another laser is directed through a mask on the drum circumference and controls modulation of the machining laser.

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