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公开(公告)号:US3900864A
公开(公告)日:1975-08-19
申请号:US40459973
申请日:1973-10-09
Applicant: BELL TELEPHONE LABOR INC
Inventor: DAPKUS PAUL DANIEL , DIXON RICHARD WAYNE , WEICK WALTER WERNER
Abstract: The specification describes a process for defining the activedisplay regions in a monolithic electroluminescent display device. According to the process, the emitting regions of a semiconductor chip are electrically and optically isolated from the rest of the chip by laser machining. The chip remains intact with grooves extending below the junction to form active junction ''''islands.'''' The technique is advantageous with indirect band gap semiconductors, such as GaP, that can be viewed through the unmachined surface. In a preferred form the grooves are formed in a grid configuration. This structure has advantages in terms of cost and simplicity of manufacture.
Abstract translation: 本说明书描述了在单片电致发光显示装置中定义有源显示区域的过程。 根据该过程,半导体芯片的发光区域通过激光加工与芯片的其余部分电隔离和光学隔离。 芯片保持完整,凹槽在结点下方延伸,形成主动结“岛”。 该技术对于可以通过未加工表面观察的间接带隙半导体(例如GaP)是有利的。 在优选的形式中,凹槽以格栅形式形成。 该结构在成本和制造简单性方面具有优点。
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公开(公告)号:US3867217A
公开(公告)日:1975-02-18
申请号:US41061973
申请日:1973-10-29
Applicant: BELL TELEPHONE LABOR INC
Inventor: MAGGS CHARLES , WEICK WALTER WERNER
CPC classification number: H05K3/027 , B23K26/18 , H01L49/02 , H05K1/0306 , H05K2201/0317 , H05K2203/025 , H05K2203/0361
Abstract: In a technique for forming thin-film circuits by laser machining, the gold conductor layer is first covered with a copper protective layer. After machining, the laser-machined gaps are cleaned by a fluid stream containing abrasive particles, during which operation the protective layer shields the gold conductors. Thereafter, the protective layer is removed by selective etching.
Abstract translation: 在通过激光加工形成薄膜电路的技术中,金导体层首先被铜保护层覆盖。 加工后,激光加工的间隙由含有磨料颗粒的流体流清洁,在此期间保护层屏蔽金导体。 此后,通过选择性蚀刻除去保护层。
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公开(公告)号:US3924093A
公开(公告)日:1975-12-02
申请号:US35873073
申请日:1973-05-09
Applicant: BELL TELEPHONE LABOR INC
CPC classification number: G03F1/54 , G03C1/705 , H01L21/0275 , Y10S430/146
Abstract: Supported photomasks useful in the fabrication of printed circuitry are produced by laser machining of amorphous iron oxide film blanks. Resolution improvement relative to that obtained by use of other film materials is ascribed to crystallization of film regions bordering those which are volatilized.
Abstract translation: 用于制造印刷电路的支持的光掩模是通过激光加工无定形氧化铁薄膜坯料制成的。 与通过使用其它膜材料获得的分辨率提高相关的归因于与挥发的膜区域相邻的膜区域的结晶。
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公开(公告)号:US3622742A
公开(公告)日:1971-11-23
申请号:US3622742D
申请日:1970-05-27
Applicant: BELL TELEPHONE LABOR INC
Inventor: COHEN MELVIN IRWIN , WEICK WALTER WERNER , WEST JOHN WESLEY
CPC classification number: B23K26/0823
Abstract: Thin film integrated circuits are formed by coating insulative substrates with conductive film and mounting them on the periphery of a rotating drum. As the drum rotates, a switched laser machines the circuit pattern by vaporizing parts of the metal film of successive substrates. Light from another laser is directed through a mask on the drum circumference and controls modulation of the machining laser.
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