公开(公告)号：US11913947B2

公开(公告)日：2024-02-27

申请号：US17355338

申请日：2021-06-23

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Haonan Liu ,  Yudan Yin ,  Ding Ding

IPC分类号： G01N33/68 ,  G01N21/33 ,  G01N21/64 ,  G01N33/52 ,  C07C309/65 ,  C07C309/73 ,  A01N1/02 ,  G01N1/40 ,  G01N33/543 ,  B01L3/00

CPC分类号： G01N33/5438 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2300/0819 ,  B01L2300/12 ,  B01L2300/165

摘要： The present disclosure provides a digital immunochip and a manufacture method thereof. The digital immunochip includes a first substrate and a second substrate which are opposite to each other. The first substrate includes: a first base substrate; at least one driving electrode on the first base substrate and configured to drive an object to be detected to move; a dielectric layer on a side of the at least one driving electrode away from the first base substrate and covering the at least one driving electrode; and a first hydrophobic layer on a side of the dielectric layer away from the first base substrate. The second substrate includes: a second base substrate; and an immunoassay substance on a side of the second base substrate proximal to the first hydrophobic layer of the first substrate and including an antigen or an antibody.