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公开(公告)号：US10187020B2
公开(公告)日：2019-01-22
申请号：US14957395
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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公开(公告)号：US20170163225A1
公开(公告)日：2017-06-08
申请号：US14957395
申请日：2015-12-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
CPC classification number: H03F3/16 , A61B5/6801 , A61B8/4444 , A61B8/5207 , G01S7/52025 , H03F1/086 , H03F3/45183 , H03F2200/408 , H03F2200/555 , H03F2203/45471 , H03F2203/45504 , H03F2203/45631 , H03F2203/45634 , H03F2203/45646 , H03F2203/45648 , H03F2203/45674 , H03F2203/45686 , H03F2203/45692 , H03F2203/45726
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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3.发明申请ARCHITECTURE OF SINGLE SUBSTRATE ULTRASONIC IMAGING DEVICES, RELATED APPARATUSES, AND METHODS 审中-公开单基底超声成像装置的结构，相关装置和方法公开(公告)号：US20170067988A1
公开(公告)日：2017-03-09
申请号：US15273377
申请日：2016-09-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。
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4.发明授权公开(公告)号：US10416298B2
公开(公告)日：2019-09-17
申请号：US15273377
申请日：2016-09-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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公开(公告)号：US20150297193A1
公开(公告)日：2015-10-22
申请号：US14689080
申请日：2015-04-17
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
CPC classification number: A61B8/56 , A61B8/4483 , A61B8/4494 , A61B8/488 , A61B8/5207 , G01S7/52033 , G01S7/52034 , G01S7/5208 , G01S7/52085 , G01S15/8915
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.
Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且输出数据模块可用于将作为数字数据流的片外所有接收信道的数据移动 。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 接收信号的片上数字化还使得超声处理和/或预处理的片上集成能够减少片外计算的负担。 公开了数据压缩架构，以便根据标准商业可用输出接口的带宽需求，促进作为数字数据流的片外数据传输。
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Patent Agency Ranking
公开(公告)号：US20190140603A1
公开(公告)日：2019-05-09
申请号：US16178117
申请日：2018-11-01
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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公开(公告)号：US20190086525A1
公开(公告)日：2019-03-21
申请号：US16178871
申请日：2018-11-02
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Methods and apparatus are described for implementing a coding scheme on ultrasound signals received by a plurality of ultrasonic transducers. The coding, and subsequent decoding, may allow for multiple ultrasonic transducers to be operated in a receive mode simultaneously while still differentiating the contribution of the individual ultrasonic transducers. Improved signal characteristics may result, including improved signal-to-noise ratio (SNR).
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8.发明申请ARCHITECTURE OF SINGLE SUBSTRATE ULTRASONIC IMAGING DEVICES, RELATED APPARATUSES, AND METHODS 有权单基底超声成像装置的结构，相关装置和方法公开(公告)号：US20160069989A1
公开(公告)日：2016-03-10
申请号：US14940837
申请日：2015-11-13
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
CPC classification number: G01S7/52019 , B06B1/0292 , B06B1/0607 , G01S7/52017 , G01S7/5202 , G10K11/346 , H03K5/13 , H03K2005/00019
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。
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9.发明申请Architecture of Single Substrate Ultrasonic Imaging Devices, Related Apparatuses, and Methods 有权单基底超声成像设备的结构，相关设备和方法公开(公告)号：US20150301165A1
公开(公告)日：2015-10-22
申请号：US14689090
申请日：2015-04-17
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
CPC classification number: G01S7/52019 , B06B1/0292 , B06B1/0607 , G01S7/52017 , G01S7/5202 , G10K11/346 , H03K5/13 , H03K2005/00019
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。
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公开(公告)号：US20210384872A1
公开(公告)日：2021-12-09
申请号：US17331538
申请日：2021-05-26
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife , Nevada J. Sanchez , Andrew J. Casper , Tyler S. Ralston
Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.
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