公开(公告)号：US20180332716A1

公开(公告)日：2018-11-15

申请号：US16045986

申请日：2018-07-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K1/02 ,  H05K13/04 ,  H05K1/03

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US20170311454A1

公开(公告)日：2017-10-26

申请号：US15497309

申请日：2017-04-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US10356913B2

公开(公告)日：2019-07-16

申请号：US16045986

申请日：2018-07-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02 ,  H05K1/03

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US10064289B2

公开(公告)日：2018-08-28

申请号：US15497309

申请日：2017-04-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: F27B9/06 ,  H05K1/11 ,  A21B1/22 ,  H05K3/34 ,  H05K1/02 ,  H05K13/04 ,  H05K1/03

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.