Display Panel, Manufacturing Method Therefor, and Display Device

    公开(公告)号:US20220069054A1

    公开(公告)日:2022-03-03

    申请号:US17415469

    申请日:2020-10-12

    IPC分类号: H01L27/32 H01L51/52 H01L51/56

    摘要: Provided are a display panel, a manufacturing method therefor, and a display device. The display panel comprises a hole in a display region and comprises: a substrate; a drive circuit layer comprising a thin film transistor; a wire, connected to the thin film transistor; one or more isolation members surrounding the hole, disposed on the side of the drive circuit layer, and located between the wire and the hole, at least one isolation member comprising a first and a second isolation layer, and an orthographic projection of a surface of the first isolation layer away from the substrate is inside that of the second isolation layer on the substrate; a planarization layer, on the side of the drive circuit layer and covering the wire; and an anode, on the side of the planarization layer and connected to the wire by a via penetrating the planarization layer.

    Substrate and fabricating method thereof, and display apparatus

    公开(公告)号:US11063070B2

    公开(公告)日:2021-07-13

    申请号:US16611003

    申请日:2019-05-13

    IPC分类号: H01L27/12

    摘要: A method of fabricating a substrate is provided. The method of fabricating the substrate includes forming a first conductive pattern; forming a first insulating layer, and forming a first blind hole in the first insulating layer; forming a conductive film layer, and removing at least a portion of the conductive film layer in the first blind hole; thinning a portion of the first insulating layer at a bottom of the first blind hole to form a second blind hole; forming an intermediate insulating layer, and forming a second via hole in the intermediate insulating layer; removing the portion of the first insulating layer and forming a first via hole in the first insulating pattern layer; and forming a second conductive pattern. The second conductive pattern directly contacts the first conductive pattern through the first via hole and the second via hole and insulates from the intermediate conductive pattern.