HEAT SINK ASSEMBLY FOR ELECTRONIC EQUIPMENT

    公开(公告)号:US20220011056A1

    公开(公告)日:2022-01-13

    申请号:US16922015

    申请日:2020-07-07

    Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

    Configurable module guides for modular electronic system

    公开(公告)号:US10470335B2

    公开(公告)日:2019-11-05

    申请号:US16022470

    申请日:2018-06-28

    Abstract: In one embodiment, an apparatus includes a frame comprising a top wall, a bottom wall, and sides defining an opening for receiving a plurality of removable electronic modules, a guide slidably insertable into the frame to partition an upper or lower portion of the opening when inserted into the frame, wherein the guide comprises a first edge for slidable engagement with the top wall or the bottom wall, and a lead screw extending from an opening in the guide spaced from a front end of the guide, to a back end of the guide for connecting the guide to the frame.

    Heat sink assembly for electronic equipment

    公开(公告)号:US11300363B2

    公开(公告)日:2022-04-12

    申请号:US16922015

    申请日:2020-07-07

    Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

    Configurable module guides for modular electronic system

    公开(公告)号:US10042396B1

    公开(公告)日:2018-08-07

    申请号:US15679763

    申请日:2017-08-17

    Abstract: In one embodiment, and apparatus includes a frame comprising a top wall, a bottom wall, and sides defining an opening for receiving a plurality of removable electronic modules, and at least two slidably removable guides extending generally parallel with the sides of the frame, two of the guides each comprising a first edge for slidable engagement with the top wall or the bottom wall and a second edge for slidable engagement with another of the at least two guides. The guides partition the opening for receiving the plurality of removable electronic modules when the guides are inserted into the frame. One or more of the guides may be removed from the frame for receiving a larger width electronic module in the frame.

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