-
1.
公开(公告)号:US12137530B2
公开(公告)日:2024-11-05
申请号:US17470465
申请日:2021-09-09
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Joel Richard Goergen , Sarma V M K Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
-
公开(公告)号:US11255897B2
公开(公告)日:2022-02-22
申请号:US16229717
申请日:2018-12-21
Applicant: Cisco Technology, Inc.
Inventor: Mohammed Ghouse , Shailesh Nayak , Damaruganath Pinjala , Rohit Dev Gupta , Mehmet Onder Cap
Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
-
公开(公告)号:US20220018891A1
公开(公告)日:2022-01-20
申请号:US17480773
申请日:2021-09-21
Applicant: Cisco Technology, Inc.
Inventor: Mohammed Ghouse , Shailesh Nayak , Damaruganath Pinjala , Rohit Dev Gupta , Mehmet Onder Cap
Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
-
公开(公告)号:US20220011056A1
公开(公告)日:2022-01-13
申请号:US16922015
申请日:2020-07-07
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Tilak Gaitonde , Prashanth Pavithran
Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.
-
公开(公告)号:US11184688B2
公开(公告)日:2021-11-23
申请号:US16672942
申请日:2019-11-04
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Joel Goergen , Arjun Guzar Jayaprakash , Naveen Kumar Bangalore Shiva Kumar
IPC: H04Q1/06 , H04Q1/04 , H05K7/18 , H04L12/931
Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.
-
公开(公告)号:US10952345B2
公开(公告)日:2021-03-16
申请号:US16001835
申请日:2018-06-06
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Rohit Dev Gupta , Shailesh R. Nayak , Viktor Brauer , Joel Richard Goergen
Abstract: In one embodiment, a cable management bracket for managing cables connected to a modular electronic system mounted on a rack comprises a fixed portion and a rotatable portion extending from the fixed portion and comprising a support member for supporting the cables, the rotatable portion rotatable with the cables to allow for removal and insertion of a module of the modular electronic system.
-
公开(公告)号:US10575429B2
公开(公告)日:2020-02-25
申请号:US15641787
申请日:2017-07-05
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Joel R. Goergen , Jatin Kohli
Abstract: In one embodiment, an apparatus is disclosed comprising a cable management bracket and a cable guide connector configured to engage a slot of a networking chassis having a length extending along a first axis. The cable guide connector comprises a center section configured to slide within the slot along the first axis and having an aperture configured to receive a retainer to secure the cable guide connector by compression at a selected position along the length of the slot. The cable guide connector further defines a plurality of apertures configured to engage a protrusion of the cable management bracket and defines a plurality of selectable angles at which the cable management bracket can be positioned relative to a second axis that is perpendicular to the first axis through which the slot extends.
-
公开(公告)号:US10387278B2
公开(公告)日:2019-08-20
申请号:US15643661
申请日:2017-07-07
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Joel R. Goergen , Jatin Kohli , Manigandan Boopalan
Abstract: In one embodiment, a device in a modular networking rack determines an online insertion and removal (OIR) time for a particular device module of a plurality of device modules contained within the modular networking rack. The device determines an OIR time for the plurality of device modules based on the OIR time for the particular device module and provides an indication of the OIR time for the plurality of device modules for display to a user.
-
公开(公告)号:US10076054B2
公开(公告)日:2018-09-11
申请号:US15243178
申请日:2016-08-22
Applicant: Cisco Technology, Inc.
Inventor: Joel R. Goergen , Rohit Dev Gupta , Arjun Jayaprakash , Robert Curto , Charles Calvin Byers
CPC classification number: H05K7/1491 , F16B2001/0035 , G02B6/444 , G02B6/4452 , G02B6/4453 , G02B6/4457 , G02B6/4471 , G02B6/4478 , H02G3/0456 , H02G3/30
Abstract: In one embodiment, an adjustable cable management system is disclosed. The system includes a tray base having a first end. The system also includes a tray door coupled to the tray base and substantially opposite the first end of the tray base when in a closed position. The system further includes a plurality of cable guides coupled to the first end of the tray base and located between the first end of the tray base and the tray door. A particular cable guide is coupled to the first end of the tray base at a selected angle from among a plurality of selectable angles.
-
公开(公告)号:US12069794B2
公开(公告)日:2024-08-20
申请号:US17858819
申请日:2022-07-06
Applicant: Cisco Technology, Inc.
Inventor: Rohit Dev Gupta , Arjun Jayaprakash Guzar , Tilak Gaitonde
IPC: H05K1/02
CPC classification number: H05K1/0203 , H05K2201/066 , H05K2201/10734
Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.
-
-
-
-
-
-
-
-
-