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1.发明授权Etch back processes of bonding material for the manufacture of through-glass vias 有权用于制造玻璃通孔的粘合材料的回蚀工艺公开(公告)号：US09263300B2
公开(公告)日：2016-02-16
申请号：US14699393
申请日：2015-04-29
Applicant: CORNING INCORPORATED
Inventor： Chih-Wei Tsai , Bor Kai Wang
CPC classification number: H01L23/49827 , C03C15/00 , H01L21/486 , H01L21/6835 , H01L23/15 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
Abstract: A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.
Abstract translation: 玻璃基板中的通孔的制造方法包括通过接合层将包括多个孔的玻璃基板的第一面接合到玻璃载体的第一面。 接合层在玻璃基板的第一面和玻璃载体的第一面之间具有厚度t，并且从玻璃基板的第一面延伸到多个孔中的至少一些孔。 该方法包括通过玻璃基板中的多个孔将结合层回蚀刻深度d。 深度d小于厚度t和深度h之和。 该方法可以包括用导电材料填充多个孔，并且从结合层和玻璃载体去除玻璃基底。
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2.发明申请ETCH BACK PROCESSES OF BONDING MATERIAL FOR THE MANUFACTURE OF THROUGH-GLASS VIAS 有权用于制造透明玻璃的粘合材料的回填工艺公开(公告)号：US20150318187A1
公开(公告)日：2015-11-05
申请号：US14699393
申请日：2015-04-29
Applicant: CORNING INCORPORATED
Inventor： Chih-Wei Tsai , Bor Kai Wang
CPC classification number: H01L23/49827 , C03C15/00 , H01L21/486 , H01L21/6835 , H01L23/15 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
Abstract: A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.
Abstract translation: 玻璃基板中的通孔的制造方法包括通过接合层将包括多个孔的玻璃基板的第一面接合到玻璃载体的第一面。 接合层在玻璃基板的第一面和玻璃载体的第一面之间具有厚度t，并且从玻璃基板的第一面延伸到多个孔中的至少一些孔。 该方法包括通过玻璃基板中的多个孔将结合层回蚀刻深度d。 深度d小于厚度t和深度h之和。 该方法可以包括用导电材料填充多个孔，并且从结合层和玻璃载体去除玻璃基底。
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公开(公告)号：US20160155696A1
公开(公告)日：2016-06-02
申请号：US15013241
申请日：2016-02-02
Applicant: CORNING INCORPORATED
Inventor： Chih-Wei Tsai , Bor Kai Wang
IPC: H01L23/498 , H01L21/683
CPC classification number: H01L23/49827 , C03C15/00 , H01L21/486 , H01L21/6835 , H01L23/15 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
Abstract: A method for manufacturing vias in a glass substrate includes bonding, through a bonding layer, a first face of the glass substrate including a plurality of holes to a first face of a glass carrier. The bonding layer has a thickness t between the first face of the glass substrate and the first face of the glass carrier and extends into at least some of the plurality of holes to a depth h from the first face of the glass substrate. The method includes etching back the bonding layer to a depth d through the plurality of holes in the glass substrate. The depth d is less than the sum of the thickness t and the depth h. The method can include filling the plurality of holes with an electrically conductive material, and de-bonding the glass substrate from the bonding layer and the glass carrier.
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