ELECTROSTATIC PROTECTION STRUCTURE AND PREPARATION METHOD THEREFOR

    公开(公告)号:US20240079404A1

    公开(公告)日:2024-03-07

    申请号:US18262100

    申请日:2022-01-21

    Inventor: Jun SUN

    CPC classification number: H01L27/0259

    Abstract: The present application relates to an electrostatic protection structure and a preparation method therefor. The electrostatic protection structure comprises a substrate, a buried layer, a first deep well, a second deep well and a third deep well. A well region of the opposite conductivity type and a heavily doped region of the same conductivity type are provided in the first deep well, and well regions and heavily doped regions of the same conductivity type are respectively provided in the second deep well and the third deep well. The first deep well, a first well region and a second well region are floating; a first heavily doped region leads out electrostatic voltage; and a sixth heavily doped region is grounded.

    ELECTROSTATIC PROTECTION DEVICE OF LDMOS SILICON CONTROLLED STRUCTURE

    公开(公告)号:US20180122794A1

    公开(公告)日:2018-05-03

    申请号:US15569848

    申请日:2016-04-29

    CPC classification number: H01L27/0262 H01L29/402 H01L29/7817 H01L29/87

    Abstract: An electrostatic protection device of an LDMOS silicon controlled structure comprises a P-type substrate (310), an N-well (320) and a P-well (330) on the substrate, a gate electrode (340) overlapping on the P-well (330) and extending to an edge of the N-well (320), a first N+ structure and a first P+ structure provided in the N-well (320), and a second N+ structure and a second P+ structure provided in the P-well(330), the first N+ structure being a drain electrode N+ structure (322), the first N+ structure being a drain electrode N+ structure (322), the first P+ structure being a drain electrode P+ structure (324), the second N+ structure being a source electrode N+ structure (332), the second P+ structure being a source P+ structure (334), and a distance from the drain electrode P+ structure (324) to the gate electrode (340) being greater than a distance from the drain electrode N+ structure (322) to the gate electrode (340).

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