TAMPER RESISTANT ELECTRONIC PACKAGES WITH QUANTUM INTERCONNECTS
    1.
    发明申请
    TAMPER RESISTANT ELECTRONIC PACKAGES WITH QUANTUM INTERCONNECTS 审中-公开
    具有量子互连的防篡改电子封装

    公开(公告)号:US20140016779A1

    公开(公告)日:2014-01-16

    申请号:US13547412

    申请日:2012-07-12

    IPC分类号: H04L9/00 H04L9/08

    摘要: A method for resisting tampering, the method including discovering a plurality of electronic packages for communication, each of the plurality of electronic packages having an associated quantum state table, mapping a plurality of communications paths among the plurality of electronic packages, for each communication path of the plurality of communications paths, making an entry into the quantum state table, negotiating key material for each of the plurality of communications paths, for a plurality of data exchanges along each of the plurality of communications paths generating a key, and encrypting a data exchange on a communications path with the key.

    摘要翻译: 一种用于抵抗篡改的方法,所述方法包括发现用于通信的多个电子包,所述多个电子包中的每一个具有关联的量子状态表,对于所述多个电子包中的多个通信路径映射每个通信路径 多个通信路径,进入量子状态表,为多个通信路径中的每个通信路径协商密钥材料,用于沿着生成密钥的多个通信路径中的每一个的多个数据交换,以及加密数据交换 在与钥匙的通信路径上。