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公开(公告)号：US11675128B2
公开(公告)日：2023-06-13
申请号：US17249060
申请日：2021-02-18
Applicant: Cisco Technology, Inc.
Inventor： Roman Bruck , Thierry J. Pinguet , Attila Mekis
Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
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公开(公告)号：US11294119B1
公开(公告)日：2022-04-05
申请号：US16952992
申请日：2020-11-19
Applicant: Cisco Technology, Inc.
Inventor： Roman Bruck , Attila Mekis
Abstract: Embodiments include a multimode interference (MMI) device with offset facets. The MMI device includes a first set of facets positioned on opposite edges of the MMI device with an optical path between the set of facets. The MMI device also includes a second set of facets positioned on opposite edges of the MMI device, where the second set of facets are offset from the first set of facets, where a second optical path passes through the MMI device between the second set of facets.
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公开(公告)号：US12025831B2
公开(公告)日：2024-07-02
申请号：US18297373
申请日：2023-04-07
Applicant: Cisco Technology, Inc.
Inventor： Roman Bruck , Thierry J. Pinguet , Attila Mekis
Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
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公开(公告)号：US11860412B2
公开(公告)日：2024-01-02
申请号：US17081852
申请日：2020-10-27
Applicant: Cisco Technology, Inc.
Inventor： Subal Sahni , Kamal V. Karimanal , Gianlorenzo Masini , Attila Mekis , Roman Bruck
CPC classification number: G02B6/1225 , G02B6/12014 , G02B2006/12061 , G02B2006/12107 , G02B2006/12135
Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
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