公开(公告)号：US11294119B1

公开(公告)日：2022-04-05

申请号：US16952992

申请日：2020-11-19

Applicant: Cisco Technology, Inc.

Inventor： Roman Bruck ,  Attila Mekis

IPC: G02B6/26 ,  G02B6/12 ,  G02B6/293

Abstract: Embodiments include a multimode interference (MMI) device with offset facets. The MMI device includes a first set of facets positioned on opposite edges of the MMI device with an optical path between the set of facets. The MMI device also includes a second set of facets positioned on opposite edges of the MMI device, where the second set of facets are offset from the first set of facets, where a second optical path passes through the MMI device between the second set of facets.

公开(公告)号：US11675128B2

公开(公告)日：2023-06-13

申请号：US17249060

申请日：2021-02-18

Applicant: Cisco Technology, Inc.

Inventor： Roman Bruck ,  Thierry J. Pinguet ,  Attila Mekis

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B6/13

Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.

公开(公告)号：US12025831B2

公开(公告)日：2024-07-02

申请号：US18297373

申请日：2023-04-07

Applicant: Cisco Technology, Inc.

Inventor： Roman Bruck ,  Thierry J. Pinguet ,  Attila Mekis

IPC: G02B6/132 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136

Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.

公开(公告)号：US11906781B2

公开(公告)日：2024-02-20

申请号：US18064506

申请日：2022-12-12

Applicant: Cisco Technology, Inc.

Inventor： Roman Bruck ,  Gianlorenzo Masini

IPC: G02B6/136 ,  G02B6/125

CPC classification number: G02B6/136 ,  G02B6/125

Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.

公开(公告)号：US11860412B2

公开(公告)日：2024-01-02

申请号：US17081852

申请日：2020-10-27

Applicant: Cisco Technology, Inc.

Inventor： Subal Sahni ,  Kamal V. Karimanal ,  Gianlorenzo Masini ,  Attila Mekis ,  Roman Bruck

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B6/12014 ,  G02B2006/12061 ,  G02B2006/12107 ,  G02B2006/12135

Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.

公开(公告)号：US11567262B2

公开(公告)日：2023-01-31

申请号：US17248579

申请日：2021-01-29

Applicant: Cisco Technology, Inc.

Inventor： Roman Bruck ,  Gianlorenzo Masini

IPC: G02B6/136 ,  G02B6/125

Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.