公开(公告)号：US20160148743A1

公开(公告)日：2016-05-26

申请号：US14550256

申请日：2014-11-21

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayan Lin

IPC: H01F27/06 ,  H01F27/28 ,  H01F27/29 ,  H01F41/10

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract translation: 在一个实施方式中，一种装置被配置成有助于电子表面贴装封装的制造或组装。 该装置包括被配置为支持共模扼流圈的共模扼流圈。 该装置包括联接到共模扼流圈的端子触点。 端子触点与连接到共模扼流圈的导线对齐。 该装置包括支撑构件，其包括与连接到共模扼流圈的导线对准的导线支撑部分和构造成支撑共模扼流器基座的中心部分。