公开(公告)号：US20160197400A1

公开(公告)日：2016-07-07

申请号：US14591120

申请日：2015-01-07

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： DAVID W. ZIMMERMAN ,  JAMES F. SEARCY ,  CHARLES I. DELHEIMER

IPC: H01Q1/50 ,  H05K1/02

CPC classification number: H01Q1/50 ,  H01L23/66 ,  H01L2223/6683 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q21/065 ,  H05K1/02 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/184 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10007 ,  H05K2201/10098 ,  H05K2203/049

Abstract: A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide.

Abstract translation: 电路板组件包括低频（LF）衬底，单片微波集成电路（MMIC），电气部件，高频（HF）衬底和天线。 LF基板由FR-4型材料形成。 LF衬底限定通过LF衬底的波导。 MMIC连接到LF基板的顶侧，并输出射频信号。 电气部件电连接到LF基板。 将HF衬底焊接到LF衬底的顶侧。 通过HF衬底的开口围绕MMIC。 垂直转换将MMIC输出的射频信号引导到波导。 多个引线键合将MMIC电连接到HF衬底，并将来自MMIC的射频信号耦合到垂直转换。 天线连接到LF衬底并且被配置为辐射来自波导的射频信号。