公开(公告)号：US10297523B2

公开(公告)日：2019-05-21

申请号：US14959635

申请日：2015-12-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Yanlin Chen ,  Zhenqing Zhao

IPC: H05K7/20 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

公开(公告)号：US09589863B2

公开(公告)日：2017-03-07

申请号：US15094038

申请日：2016-04-08

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Yanlin Chen ,  Zhenqing Zhao

IPC: H01L23/36 ,  H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/3737 ,  H01L2224/0603 ,  H01L2224/4846

Abstract: A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.

Abstract translation: 本文提供了功率模块和热接口结构。 热界面结构包括：基底和分散在基底中的多个填料颗粒。 当填料颗粒处于压力下时，填料颗粒的至少一部分变形，并且至少两个相邻的填料颗粒彼此部分接触以形成用于传递热量的导热路径。