公开(公告)号：US20240218215A1

公开(公告)日：2024-07-04

申请号：US18288121

申请日：2022-04-26

Applicant: DENKA COMPANY LIMITED

Inventor： Tometomo UCHIDA HAMAGUCHI ,  Takako TANIGAWA HOSHINO ,  Megumi SUDO ,  Hiromi OKUMURA ,  Jun YOSHIDA

IPC: C09J135/02 ,  C08F222/20 ,  C09J4/00 ,  C09J5/00 ,  H01L21/683

CPC classification number: C09J135/02 ,  C08F222/20 ,  C09J4/00 ,  C09J5/00 ,  H01L21/6836 ,  C08F2800/20 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A composition for temporary bonding with excellent compatibility, suitability for spin coating process, heat resistance, and suitability for various release processes. The composition includes:



(A) a bifunctional (meth)acrylate not having a cyclic structure;
(B) a bifunctional (meth)acrylate having a cyclic structure; and
(C) a photo radical polymerization initiator.