公开(公告)号：US20150189794A1

公开(公告)日：2015-07-02

申请号：US14582877

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi TASHIMA ,  Jyunichi OOGOSHI ,  Takayuki UCHIDA ,  Katsuhiko HAYASHI ,  Shinsuke OOTA

IPC: H05K7/20 ,  B62D5/04

CPC classification number: B62D5/0406 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/1432 ,  H05K7/20854 ,  H05K2201/09972

Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract translation: 在电子控制单元中，高温发生装置安装在板的第一表面或第二表面上，散热构件面向板的第一表面定位，并且导热构件位于 板和散热构件。 导热构件与高发热装置接触，以将高发热装置的热传递到散热构件。 安装在板上的高发热装置的数量与布置在第一表面的第一有限区域内的高发热装置的数量或第二表面的第二限制区域的数量的比率大于 预定比例。 第二有限区域位于与第一有限区域对应的位置。