公开(公告)号：US20190014692A1

公开(公告)日：2019-01-10

申请号：US16067971

申请日：2016-12-16

Applicant: DENSO CORPORATION

Inventor： Shinji SHIBATA ,  Takayuki UCHIDA ,  Tsuyoshi TASHIMA

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/40 ,  H01L25/11 ,  B62D5/04 ,  B62D6/00

Abstract: An electronic control unit includes: a substrate; a plurality of heat generating components that are provided on one surface of the substrate and generate heat during operation; a heat conducting component that is formed of a material having a heat conductivity equal to or higher than a predetermined value and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components; and a controller that is provided on the substrate and controls the operation of each of the plurality of heat generating components to control the object to be controlled.

公开(公告)号：US20190023308A1

公开(公告)日：2019-01-24

申请号：US16067972

申请日：2016-12-16

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi TASHIMA ,  Takayuki UCHIDA

IPC: B62D5/04 ,  H01L23/40 ,  H01L23/31 ,  H05K1/02

Abstract: An electronic control unit includes: a substrate (10); a heat generating component (20) provided on one surface (11) of the substrate and generates heat during operation; a heat conducting component (40) formed of a material having a heat conductivity equal to or higher than a predetermined value and provided on the one surface of the substrate such that at least a part of the heat conducting component is located in a range (R1) of a predetermined distance (L) from the heat generating component; a controller (60) provided on the substrate and controlling the operation of the heat generating component to control the object to be controlled; and a radiator (70) provided adjacent to the one surface of the substrate to radiate heat from the heat generating component and the heat conducting component. A distance (d1, d3) between the heat generating component and the radiator is equal to or shorter than a distance (d2, d4) between the heat conducting component and the radiator.

公开(公告)号：US20150189794A1

公开(公告)日：2015-07-02

申请号：US14582877

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi TASHIMA ,  Jyunichi OOGOSHI ,  Takayuki UCHIDA ,  Katsuhiko HAYASHI ,  Shinsuke OOTA

IPC: H05K7/20 ,  B62D5/04

CPC classification number: B62D5/0406 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/1432 ,  H05K7/20854 ,  H05K2201/09972

Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract translation: 在电子控制单元中，高温发生装置安装在板的第一表面或第二表面上，散热构件面向板的第一表面定位，并且导热构件位于 板和散热构件。 导热构件与高发热装置接触，以将高发热装置的热传递到散热构件。 安装在板上的高发热装置的数量与布置在第一表面的第一有限区域内的高发热装置的数量或第二表面的第二限制区域的数量的比率大于 预定比例。 第二有限区域位于与第一有限区域对应的位置。

公开(公告)号：US20150187732A1

公开(公告)日：2015-07-02

申请号：US14578561

申请日：2014-12-22

Applicant: DENSO CORPORATION

Inventor： Tomoaki YOSHIMI ,  Takayuki UCHIDA

IPC: H01L25/065 ,  H01L23/42 ,  H01L23/367 ,  H01L23/053 ,  H01L23/24

CPC classification number: H01L23/367 ,  H01L23/053 ,  H01L23/24 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

Abstract: In an electronic control device, semiconductor modules are disposed in a power region of a substrate, and on a surface of a substrate adjacent to a housing to radiate heat from rear surfaces to the housing through a heat radiation layer. Therefore, a heat radiation performance improves. Further, a first distance from an end surface of a power region corresponding part corresponding to the power region to the substrate is shorter than a second distance from an end surface of a control region corresponding part corresponding to a control region of the substrate to the substrate. Therefore, a closed circuit bridged by parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part. A noise generated from the semiconductor modules is returned to noise sources through the closed circuit without affecting the control region.

Abstract translation: 在电子控制装置中，半导体模块设置在基板的功率区域中，并且在与壳体相邻的基板的表面上，通过散热层从后表面向壳体辐射热量。 因此，散热性能提高。 此外，从与功率区域对应的功率区域对应部分的端面到基板的第一距离比距离对应于基板的控制区域到基板的控制区域对应部分的端面的第二距离短 。 因此，主要在功率区域和功率区域对应部分的区域中形成由寄生电容桥接的闭路。 从半导体模块产生的噪声通过闭路返回到噪声源，而不影响控制区域。