公开(公告)号：US09957389B2

公开(公告)日：2018-05-01

申请号：US15036097

申请日：2014-11-25

Applicant: DOOSAN CORPORATION

Inventor： Dong Hee Jung ,  Duk Sang Han ,  Jeong Don Kwon ,  Moo Hyun Kim ,  Do Woong Hong

IPC: C08L71/12 ,  H05K1/02 ,  C08J5/24 ,  C08L63/00 ,  C08J3/24 ,  H05K1/03

CPC classification number: C08L71/12 ,  C08J3/246 ,  C08J5/24 ,  C08J2371/12 ,  C08J2463/02 ,  C08J2479/00 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0353 ,  H05K2201/0129 ,  C08L71/126 ,  C08L79/04

Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.