公开(公告)号：US10584239B2

公开(公告)日：2020-03-10

申请号：US16424251

申请日：2019-05-28

Applicant: DOOSAN CORPORATION

Inventor： Dong Hee Jung ,  Jeong Don Kwon ,  Moo Hyun Kim ,  Do Woong Hong

IPC: C08L71/02 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  C08G65/48 ,  C08K3/28 ,  C08J5/08 ,  C08K9/06 ,  C08K5/00 ,  H05K3/02 ,  H05K1/03

Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.

公开(公告)号：US09957389B2

公开(公告)日：2018-05-01

申请号：US15036097

申请日：2014-11-25

Applicant: DOOSAN CORPORATION

Inventor： Dong Hee Jung ,  Duk Sang Han ,  Jeong Don Kwon ,  Moo Hyun Kim ,  Do Woong Hong

IPC: C08L71/12 ,  H05K1/02 ,  C08J5/24 ,  C08L63/00 ,  C08J3/24 ,  H05K1/03

CPC classification number: C08L71/12 ,  C08J3/246 ,  C08J5/24 ,  C08J2371/12 ,  C08J2463/02 ,  C08J2479/00 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0353 ,  H05K2201/0129 ,  C08L71/126 ,  C08L79/04

Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

公开(公告)号：US10590272B2

公开(公告)日：2020-03-17

申请号：US15538488

申请日：2015-12-21

Applicant: DOOSAN CORPORATION

Inventor： Dong Hee Jung ,  Jeong Don Kwon ,  Moo Hyun Kim ,  Do Woong Hong

IPC: C08L71/02 ,  C08K3/28 ,  C08K5/00 ,  C08K9/06 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  H05K3/02 ,  B32B5/02 ,  B32B5/26 ,  C08L71/12 ,  C08J5/08 ,  C08G65/48 ,  H05K1/03 ,  C08K3/10 ,  C08K5/01 ,  C08K5/49 ,  C08K5/02 ,  C08K3/22

Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.