公开(公告)号：US20240279458A1

公开(公告)日：2024-08-22

申请号：US18646300

申请日：2024-04-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kosuke OKUNO ,  Masaya KOYAMA

IPC: C08L53/00 ,  C08L71/12 ,  C09D153/00 ,  C09D171/12 ,  H05K1/03

CPC classification number: C08L53/00 ,  C08L71/12 ,  C09D153/00 ,  C09D171/12 ,  H05K1/0373

Abstract: A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy group in a molecule thereof. The curing agent contains an allyl compound expressed by formula (3). In the formula (1), p indicates an integer from 0 to 10, Z indicates an arylene group, and R1 to R3 each independently indicate either a hydrogen atom or an alkyl group. In the formula (2), R4 indicates either a hydrogen atom or an alkyl group. In the formula (3), RA indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.

公开(公告)号：US12037492B2

公开(公告)日：2024-07-16

申请号：US17842231

申请日：2022-06-16

Applicant: TEKNOR APEX COMPANY

Inventor： Mark Elkovitch ,  Richard Barnes

IPC: C08L77/02 ,  C08L71/12

CPC classification number: C08L77/02 ,  C08L71/12 ,  C08L2201/02

Abstract: A composition including a compatibilized blend of polyamide, polyphenylene ether and a flameproofing agent that synergistically interact such that plaques produced from the composition pass a glow wire ignition temperature test (GWIT) without producing a flame. Advantageously, the flameproofing agent is non-halogenated and the compositions also free of other halogen containing components. In addition, the compositions are free of fillers and are unexpectedly still able to pass the noted tests.

公开(公告)号：US11939466B2

公开(公告)日：2024-03-26

申请号：US17267991

申请日：2019-09-13

Applicant: TORAY Industries, Inc.

Inventor： Kohei Miyamoto ,  Yusuke Tojo ,  Makito Yokoe ,  Kosuke Shirotani ,  Yasuo Maeda

IPC: C08L67/02 ,  B32B15/085 ,  B32B15/09 ,  B32B27/18 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C08K5/50 ,  C08L23/06 ,  C08L23/08 ,  C08L25/06 ,  C08L25/08 ,  C08L67/00 ,  C08L71/12 ,  C08L81/04 ,  B32B15/18 ,  B32B15/20

CPC classification number: C08L67/02 ,  B32B15/09 ,  B32B27/20 ,  B32B27/36 ,  B32B15/085 ,  B32B15/18 ,  B32B15/20 ,  B32B27/18 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B2270/00 ,  B32B2307/204 ,  B32B2457/00 ,  C08K5/50 ,  C08L23/06 ,  C08L23/08 ,  C08L23/0884 ,  C08L25/06 ,  C08L25/08 ,  C08L67/00 ,  C08L71/12 ,  C08L81/04

Abstract: Provided is a thermoplastic polyester resin composition comprising 100 parts by weight of (A) a non-liquid crystal thermoplastic polyester resin, 45 to 150 parts by weight of (B) a thermoplastic resin that is different from the non-liquid crystal thermoplastic polyester resin and has a dielectric loss tangent of not more than 0.005 when measured at a frequency of 5.8 GHz by the cavity resonance perturbation method, 2 to 20 parts by weight of (C) a compatibilizer having at least one reactive functional group selected from epoxy, acid anhydride, oxazoline, isocyanate, and carbodiimide groups, and 0.2 to 5 parts by weight of (D) at least one compound selected from tertiary amines, amidine compounds, organic phosphines and salts thereof, imidazoles, and boron compounds, wherein the ratio of the sum of the thermoplastic resin (B) and the compatibilizer (C) is in the range of 50 to 150 parts by weight and the weight ratio (B)/(C) of the thermoplastic resin (B) to the compatibilizer (C) is in the range of 8 to 50. The thermoplastic polyester resin composition can be molded into an article with low dielectric properties, excellent mechanical properties, and high bondability to metals.

公开(公告)号：US11939443B2

公开(公告)日：2024-03-26

申请号：US17632067

申请日：2020-07-07

Applicant: NIPPON SODA CO., LTD.

Inventor： Shota Osumi ,  Izumi Tando ,  Hiroki Ueda ,  Yoshio Hayakawa

IPC: C08J5/24 ,  B32B5/02 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  C08L53/02 ,  C08L71/12

CPC classification number: C08J5/244 ,  B32B5/02 ,  B32B5/022 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  C08L53/02 ,  C08L71/12 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/308

Abstract: A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

公开(公告)号：US20230407062A1

公开(公告)日：2023-12-21

申请号：US17976959

申请日：2022-10-31

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  WEI-RU HUANG ,  CHIA-LIN LIU

IPC: C08L21/00 ,  C08L71/12 ,  C08K7/26 ,  C08K5/00

CPC classification number: C08L21/00 ,  C08L71/12 ,  C08L2203/20 ,  C08K5/0025 ,  C08K2201/005 ,  C08K7/26

Abstract: A low-dielectric substrate material and a metal substrate using the same are provided. The low-dielectric substrate material includes a rubber resin composition, at least one inorganic filler, and borosilicate-type hollow microparticles. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one inorganic filler is selected from the group consisting of magnesium oxide, aluminum oxide, silicon oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, and aluminum silicate. An amount of the borosilicate-type hollow microparticles is not more than 10 phr relative to 100 phr of the rubber resin composition.

公开(公告)号：US11771801B2

公开(公告)日：2023-10-03

申请号：US16617726

申请日：2018-06-14

Applicant: Evonik Operations GmbH

Inventor： Balaji Prabhu ,  Andrew Wood ,  Mahrokh Dadsetan ,  Andreas Karau ,  Harsh Patel ,  Marc Knebel ,  Suneel Bandi

IPC: A61L27/26 ,  C08L23/06 ,  C08L71/12 ,  A61L27/16 ,  A61L27/18 ,  A61L27/34

CPC classification number: A61L27/26 ,  A61L27/16 ,  A61L27/18 ,  A61L27/34 ,  C08L23/06 ,  C08L71/12 ,  C08L2203/02 ,  C08L2205/025 ,  C08L2205/035

Abstract: The present invention comprises a polymer and/or polymer composite based sleeve to be fitted between an extended body, such the neck, trunnion, and/or stem of a hip implant, and a receiving body, such as a femoral head in a hip implant, that reduces wear, decreases toxic material from wear debris, enhances the mechanical connection of the extension and receiving body, reduces or eliminates impingement with receiving body, delocalize stress concentrations, and may also serve as a modifying junction between an extension and receiving body of unmatched size. The polymeric based sleeve presently disclosed comprises an inert and/or biologically favorable material which may be used in its virgin form or contain biocompatible additives. In order to best match patient and implant requirements, modifications may be made in the length, thickness, composition, as well as the presence of a taper, or lack thereof, in order to be compatible with existing devices.

公开(公告)号：US20230159754A1

公开(公告)日：2023-05-25

申请号：US17530978

申请日：2021-11-19

Applicant: The Boeing Company

Inventor： Ying Shi ,  Timothy J. Luchini ,  Marcos Pantoja ,  Alexander M. Rubin

IPC: C08L79/08 ,  C08L71/12 ,  B29C43/00

CPC classification number: C08L79/08 ,  C08L71/12 ,  B29C43/003 ,  B29K2071/12

Abstract: A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.

公开(公告)号：US20230151212A1

公开(公告)日：2023-05-18

申请号：US17557893

申请日：2021-12-21

Applicant: Elite Electronic Material (KunShan) Co., Ltd.

Inventor： Yan ZHANG ,  Rongtao WANG ,  Ningning JIA

IPC: C08L71/12 ,  C08K7/22 ,  C08K3/36 ,  C08K3/40

CPC classification number: C08L71/12 ,  C08K7/22 ,  C08K3/36 ,  C08K3/40

Abstract: A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.

公开(公告)号：US20190194453A1

公开(公告)日：2019-06-27

申请号：US16229591

申请日：2018-12-21

Applicant: Brewer Science, Inc.

Inventor： Xiao Liu ,  Qi Wu ,  Rama Puligadda ,  Dongshun Bai ,  Baron Huang

IPC: C08L71/12 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528

CPC classification number: C08L71/12 ,  C08L2203/20 ,  H01L23/3114 ,  H01L23/528 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/02379

Abstract: Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

公开(公告)号：US20180328520A1

公开(公告)日：2018-11-15

申请号：US15768181

申请日：2015-10-14

Applicant: SABIC Global Technologies

Inventor： Guangtao CHEN ,  Ying NA ,  Yonglei XU

IPC: F16L9/12 ,  C08L53/02 ,  C08K5/521

CPC classification number: F16L9/12 ,  C08K5/521 ,  C08L25/06 ,  C08L25/10 ,  C08L53/025 ,  C08L71/12

Abstract: A water pipe for mining operations has an outer diameter of 20 to 200 millimeters and a wall thickness of 2 to 20 millimeters. The water pipe includes a composition containing 58 to 82 parts by weight poly(phenylene ether), 8 to 18 parts by weight of a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, 0 to 15 parts by weight of polystyrene selected from the group consisting of homopolystyrenes, rubber-modified polystyrenes, and combinations thereof, and 10 to 20 parts by weight of a flame retardant comprising an organophosphate ester, wherein parts by weight values are based on 100 parts by weight total of the poly(phenylene ether), the hydrogenated block copolymer, the polystyrene, and the flame retardant. The water pipe exhibits a desirable balance of impact strength, tensile strength, burst pressure resistance, static pressure resistance, and flame retardancy.