公开(公告)号：US20180263106A1

公开(公告)日：2018-09-13

申请号：US15914228

申请日：2018-03-07

Applicant: Delphi International Operations Luxembourg S.A.R.L

Inventor： Timo Feismann ,  Matthias Rieke

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/14 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  F04D25/06 ,  F04D25/08 ,  F04D29/28

CPC classification number: H05K1/0203 ,  F04D25/068 ,  F04D25/08 ,  F04D29/282 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/144 ,  H05K7/20172 ,  H05K7/20863 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/1009

Abstract: An electronic assembly including a cooling device comprises a cooling plate equipped, on its upper face, with a plurality of pin-fins; a first printed circuit board including at least one heat-generating zone bearing against the lower face of the cooling plate; each pin including a blowing means comprising a hub equipped with blades, the blades being arranged axially along each pin so as to be able to rotate about the pin, thus creating a flow of air for cooling the pins.