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公开(公告)号：US20220285071A1
公开(公告)日：2022-09-08
申请号：US17653134
申请日：2022-03-02
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Mingzhun ZHANG , Jinping ZHOU , Min ZHOU , Shouyu HONG , Qingdong CHEN
Abstract: A multi-winding inductor includes a magnetic core including four magnetic columns and a winding assembly including two windings. Each winding includes three portions. The first and third portions of the first winding are respectively between the first and the second magnetic columns, and the third and the fourth magnetic columns; and the first and third portions of the second winding are respectively between the fourth and the first magnetic columns, and the second and the third magnetic columns. Both the first portions of two windings extend to a surface of the magnetic core and respectively form a first and a third pins. The winding is a flat wire with the thickness less than the width, and the width direction is parallel to an extension direction of the first magnetic column.
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公开(公告)号：US20220285075A1
公开(公告)日：2022-09-08
申请号：US17684459
申请日：2022-03-02
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Mingzhun ZHANG , Jinping ZHOU , Min ZHOU , Shouyu HONG , Qingdong CHEN
Abstract: A multi-winding inductor includes a magnetic core including three magnetic columns and two windings. Each winding includes a first, a second and a third portions. The first magnetic column is arranged between the first portion of the first winding and the first portion of the second winding; the second magnetic column is arranged on one side of the first portion of the first winding and the third portion of the second winding; and the third magnetic column is arranged between the third portion of the first winding and the third portion of the second winding. The first and the second portions of two windings respectively form pins on opposite sides of the magnetic core.
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3.发明申请公开(公告)号：US20200221582A1
公开(公告)日：2020-07-09
申请号：US16731078
申请日：2019-12-31
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Shouyu HONG , Qingdong CHEN , Ganyu ZHOU , Yan CHEN , Xiaoni XIN , Pengkai JI
Abstract: The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.
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公开(公告)号：US20220392691A1
公开(公告)日：2022-12-08
申请号：US17804601
申请日：2022-05-31
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Qingdong CHEN , Wen HAN , Shouyu HONG , Ganyu ZHOU , Zhiheng FU , Jinping ZHOU
Abstract: The present invention provides a magnetic element, a method for manufacturing the same and a substrate. The magnetic element includes: a first wiring region including a first conductive layer and a second conductive layer which are arranged along a first direction; a second wiring region including a third conductive layer and a fourth conductive layer which are arranged along a second direction perpendicular to the first direction and are disposed in opposite sides of the second wiring region, respectively; an accommodating space disposed between the third conductive layer and the fourth conductive layer, wherein the second conductive layer is disposed on one side of the first conductive layer away from the accommodating space; and a magnetic column disposed within the accommodating space, wherein the third conductive layer includes a first wiring region directly connected to the first conductive layer, to form a part of windings of the magnetic element.
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Patent Agency Ranking
公开(公告)号：US20230230761A1
公开(公告)日：2023-07-20
申请号：US18156424
申请日：2023-01-19
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Shouyu HONG , Qingdong CHEN , Shuairan BI , Qian WAN , Zengsheng WANG , Ganyu ZHOU , Zhiheng FU , Jinping ZHOU , Yiqing YE
CPC classification number: H01F27/306 , H01F27/24 , H01F27/29 , H01F27/40
Abstract: The present disclosure provides a magnetic element, including: a magnetic core with at least one magnetic column extending along a first direction; a first winding surrounding the magnetic column; a second winding at least partially surrounding the first winding; and a third winding at least partially surrounding the second winding. The number of turns of the second winding is less than or equal to the number of turns of the first winding. The number of turns of the third winding is less than or equal to the number of turns of the first winding.
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公开(公告)号：US20230230747A1
公开(公告)日：2023-07-20
申请号：US18156427
申请日：2023-01-19
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Shouyu HONG , Qingdong CHEN , Shuairan BI , Qian WAN , Zengsheng WANG , Ganyu ZHOU , Zhiheng FU , Jinping ZHOU , Yiqing YE
CPC classification number: H01F27/24 , H01F27/306 , H01F27/292
Abstract: The present disclosure provides a magnetic element, including: a magnetic column extending along a first direction; a first winding surrounding the magnetic column, connected to a first terminal located on a first side of the magnetic element, and the first terminal has a first projection of the first terminal on a first side surface of the magnetic element; and a second winding surrounding the magnetic column and at least partially outside the first winding, wherein the second winding has a first projection of the second winding on the first side surface of the magnetic element, the first projection of the first terminal is at least partially outside the first projection of the second winding, the second winding is a flatwise-wound winding, and the number of turns of the first winding is greater than or equal to the number of turns of the second winding.
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公开(公告)号：US20240274345A1
公开(公告)日：2024-08-15
申请号：US18642793
申请日：2024-04-22
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Shouyu HONG , Ganyu ZHOU , Zhiheng FU , Yan TONG , Qingdong CHEN , Xiaoni XIN , Jinping ZHOU , Pengkai JI , Yiqing YE
CPC classification number: H01F27/2804 , H01F27/24 , H01F27/324 , H01F41/0206 , H01F41/041 , H01F41/125
Abstract: The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a metal wiring layer on an outer side of the insulation layer through a metallization process; and dividing at least part of the metal wiring layer into a multi-turn metal winding through a mechanically dividing process.
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公开(公告)号：US20210005378A1
公开(公告)日：2021-01-07
申请号：US17024720
申请日：2020-09-18
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Shouyu HONG , Ganyu ZHOU , Zhiheng FU , Yan TONG , Qingdong CHEN , Xiaoni XIN , Jinping ZHOU , Pengkai JI , Yiqing YE
Abstract: The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.
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公开(公告)号：US20200219846A1
公开(公告)日：2020-07-09
申请号：US16735716
申请日：2020-01-07
Applicant: Delta Electronics (Shanghai) Co., Ltd.
Inventor： Pengkai JI , Xiaoni XIN , Yan CHEN , Qingdong CHEN , Shouyu HONG , Jianhong ZENG , Zhenqing ZHAO
IPC: H01L25/065 , H01L23/538 , H01L23/31 , H01L23/522
Abstract: A multi-chip package power module according to the present disclosure, comprising: multiple chips, including a first chip and a second chip that are arranged adjacently; a first conductive member, at least partially arranged between the first chip and the second chip, and a second conductive member, at least partially arranged between the first chip and the second chip, where the first conductive member is electrically connected to a power pin of the first chip, the second conductive member is electrically connected to a power pin of the second chip, and the multiple chips, the first conductive member and the second conductive member are all embedded in an insulating package material. For the multi-chip package power module according to the present disclosure, the power output current of the chip can be directly led out from two opposite sides through the conductive member to obtain a symmetrical path.
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