公开(公告)号：US20170330827A1

公开(公告)日：2017-11-16

申请号：US15376458

申请日：2016-12-12

Applicant: Digi International Inc.

Inventor： Mike Oliver Rohrmoser ,  Sebastien Joseph Xavier Meyer

IPC: H01L23/498 ,  H05K1/02 ,  H01L23/552 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/5386 ,  H01L23/552 ,  H05K1/0287 ,  H05K1/111 ,  H05K1/117 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10159 ,  H05K2201/10659 ,  H05K2201/10719

Abstract: A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.