公开(公告)号：US11752751B2

公开(公告)日：2023-09-12

申请号：US17277565

申请日：2018-09-20

Applicant: Dow Global Technologies LLC

Inventor： Haiyang Yu ,  Wanfu Ma ,  Xin Liu

IPC: B32B37/12 ,  A43B13/04 ,  A43B13/12 ,  B32B5/18 ,  B32B7/12 ,  B32B25/04 ,  B32B25/08 ,  B32B25/14 ,  B32B25/16 ,  B32B27/06 ,  B32B27/32 ,  B32B37/10 ,  B32B37/18 ,  B32B37/02 ,  B29D35/14

CPC classification number: B32B37/12 ,  A43B13/04 ,  A43B13/12 ,  B32B5/18 ,  B32B7/12 ,  B32B25/045 ,  B32B25/08 ,  B32B25/14 ,  B32B25/16 ,  B32B27/065 ,  B32B27/327 ,  B32B37/10 ,  B32B37/182 ,  B29D35/142 ,  B32B37/02 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2266/025 ,  B32B2307/30 ,  B32B2307/54 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2437/02

Abstract: A process of adhering a foam structure to a rubber substrate is provided. The foam structure is composed of a first composition comprising a first ethylene-based polymer having a peak melting temperature TE1. A film composed of a second composition comprising a second ethylene-based polymer having a melt index≤10 g/10 min and a peak melting temperature TE2 is applied to the surface of the rubber substrate to form a rubber substrate/film configuration. A compression force is applied at a temperature Tv (38° C.≤TE2

公开(公告)号：US20220032596A1

公开(公告)日：2022-02-03

申请号：US17277565

申请日：2018-09-20

Applicant: Dow Global Technologies LLC

Inventor： Haiyang Yu ,  Wanfu Ma ,  Xin Liu

IPC: B32B37/12 ,  B32B5/18 ,  B32B25/04 ,  B32B25/14 ,  B32B7/12 ,  B32B25/08 ,  B32B25/16 ,  B32B27/06 ,  B32B27/32 ,  B32B37/10 ,  B32B37/18 ,  A43B13/04 ,  A43B13/12

Abstract: A process of adhering a foam structure to a rubber substrate is provided. The foam structure is composed of a first composition comprising a first ethylene-based polymer having a peak melting temperature TE1. A film composed of a second composition comprising a second ethylene-based polymer having a melt index≤10 g/10 min and a peak melting temperature TE2 is applied to the surface of the rubber substrate to form a rubber substrate/film configuration. A compression force is applied at a temperature Tv (38° C.≤TE2