Optical coupler and a method for assembling an optical coupler

    公开(公告)号:US11256040B1

    公开(公告)日:2022-02-22

    申请号:US16878544

    申请日:2020-05-19

    Applicant: DustPhotonics

    Abstract: The disclosure describes a method for assembling an optical coupler, the method may include (a) inserting optical fibers of an array of optical fibers through an array of openings of a mount of the optical coupler so that tips of the optical fibers pass through the array of openings of the mount and reach an adaptor; wherein the array of openings of the mount exhibit a first positioning accuracy; (b) using the adaptor to position the tips of the optical fibers at predefined locations, at a second positioning accuracy that is higher than the first positioning accuracy; (c) fixing the tips of the optical fibers to the mount while maintaining the tips of the optical fibers at the predefined locations; and (d) detaching the mount from the adaptor.

    DEVICE AND METHOD FOR HEAT DISSIPATION
    2.
    发明申请

    公开(公告)号:US20190271818A1

    公开(公告)日:2019-09-05

    申请号:US15908852

    申请日:2018-03-01

    Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

    OPTICAL COUPLER AND OPTICAL FIBER PASSIVE ALIGNMENT

    公开(公告)号:US20190129105A1

    公开(公告)日:2019-05-02

    申请号:US15796860

    申请日:2017-10-30

    Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

    Optical coupler and optical fiber passive alignment

    公开(公告)号:US10656349B2

    公开(公告)日:2020-05-19

    申请号:US15796860

    申请日:2017-10-30

    Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

    Device and method for heat dissipation

    公开(公告)号:US10534146B2

    公开(公告)日:2020-01-14

    申请号:US15908852

    申请日:2018-03-01

    Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

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