公开(公告)号：US20190129105A1

公开(公告)日：2019-05-02

申请号：US15796860

申请日：2017-10-30

Applicant: DustPhotonics Ltd.

Inventor： Jacob Hasharoni ,  Ben Rubovitch ,  Mordechai Cabessa ,  Amir Geron

IPC: G02B6/42

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

公开(公告)号：US20190036618A1

公开(公告)日：2019-01-31

申请号：US15663854

申请日：2017-07-31

Applicant: DustPhotonics Ltd.

Inventor： Jacob Hasharoni

IPC: H04B10/80 ,  G02B6/42 ,  H04B10/25

Abstract: A high-frequency optoelectronic module, that includes a first chip, a substrate and at least one optoelectronic unit. The first chip includes a set of high-frequency electrical IO interfaces. The at least one optoelectronic unit includes a group of high-frequency electrical IO interfaces and a group of high-frequency optical IO interfaces. The group of high-frequency optical IO interfaces is coupled to the group of high-frequency electrical IO interfaces. The substrate is coupled to the first chip and the at least one optoelectronic chip. The set of high-frequency electrical IO interfaces is coupled to the group of high-frequency electrical IO interfaces via a group of conductors. A length of each conductor of the group of conductors is of a scale that does not exceed a millimetric scale. The at least one optoelectronic circuit is configured to (a) convert high-frequency output electrical signals from the first chip to high-frequency output optical signals, and (b) convert high-frequency input optical signals sent towards the first chip to high-frequency input electrical signals. The high-frequency it not smaller than one hundred gigabits per second.

公开(公告)号：US10656349B2

公开(公告)日：2020-05-19

申请号：US15796860

申请日：2017-10-30

Applicant: DustPhotonics Ltd.

Inventor： Jacob Hasharoni ,  Ben Rubovitch ,  Mordechai Cabessa ,  Amir Geron

IPC: G02B6/42 ,  H01S5/183 ,  H01S5/022

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

公开(公告)号：US10447407B2

公开(公告)日：2019-10-15

申请号：US15663854

申请日：2017-07-31

Applicant: DustPhotonics Ltd.

Inventor： Jacob Hasharoni

IPC: H04B10/00 ,  H04B10/80 ,  G02B6/42 ,  H04B10/25

Abstract: A high-frequency optoelectronic module, that includes a first chip, a substrate and at least one optoelectronic unit. The first chip includes a set of high-frequency electrical IO interfaces. The at least one optoelectronic unit includes a group of high-frequency electrical IO interfaces and a group of high-frequency optical IO interfaces. The group of high-frequency optical IO interfaces is coupled to the group of high-frequency electrical IO interfaces. The substrate is coupled to the first chip and the at least one optoelectronic chip. The set of high-frequency electrical IO interfaces is coupled to the group of high-frequency electrical IO interfaces via a group of conductors. A length of each conductor of the group of conductors is of a scale that does not exceed a millimetric scale. The at least one optoelectronic circuit is configured to (a) convert high-frequency output electrical signals from the first chip to high-frequency output optical signals, and (b) convert high-frequency input optical signals sent towards the first chip to high-frequency input electrical signals. The high-frequency it not smaller than one hundred gigabits per second.